XC3S400-4FGG456C

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XC3S400-4FGG456C

IC FPGA 264 I/O 456FBGA

  • Fabricante
  • Mfr. Parte #XC3S400-4FGG456C
  • Paquete FBGA-456
  • Hoja de datos
  • En stock7855

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Especificaciones

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 896
NumberofLogicElements/Cells 8064
TotalRAMBits 294912
NumberofI/O 264
NumberofGates 400000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 456-BBGA

Descripción general

Description

The XC3S400-4FGG456C is a Field-Programmable Gate Array (FPGA) from Xilinx's Spartan-3 family. Designed for cost-sensitive applications, it features 400,000 system gates and comes in a 456-ball Fine Pitch Ball Grid Array (FBGA) package. This FPGA operates at a maximum clock speed of 100 MHz and supports multiple I/O standards, making it versatile for various digital design applications.
The XC3S400 is known for its low power consumption and ease of use, providing designers with a variety of programmable logic resources, including Look-Up Tables (LUTs), flip-flops, and dedicated multipliers. It also supports advanced design tools like Vivado and ISE, which facilitate efficient programming and debugging.
Common applications include consumer electronics, automotive systems, and telecommunications, where flexibility and adaptability are crucial. Overall, the XC3S400-4FGG456C is an excellent choice for developers looking to implement custom logic solutions in a compact and efficient manner.

Features

The XC3S400-4FGG456C is a member of the Spartan-3 family of FPGAs (Field Programmable Gate Arrays) from Xilinx. Key features include:
- Logic Cells: Approximately 400,000 system gates and 10,000 logic cells, enabling complex designs.
- Performance: Operates at a maximum clock frequency of up to 200 MHz.
- I/O Capabilities: Supports up to 456 I/O pins with various voltage levels, allowing flexible interfacing.
- Block RAM: Contains up to 18 Kbits of distributed RAM, facilitating efficient data storage and manipulation.
- DSP Resources: Includes dedicated DSP slices for high-performance digital signal processing tasks.
- Configurable: Users can configure the FPGA to meet specific application needs through HDL design languages like VHDL and Verilog.
- Development Support: Compatible with Xilinx design tools, providing extensive support for design, simulation, and debugging.
This FPGA is suitable for applications in telecommunications, automotive, consumer electronics, and more, offering a blend of performance and configurability.

Package

The XC3S400-4FGG456C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically the 456-ball version. This package type offers efficient thermal management and is designed for high-density applications.

Pinout

The XC3S400-4FGG456C is a Spartan-3 FPGA from Xilinx. It has a pin count of 456. The functions of these pins include general-purpose I/O (GPIO), dedicated configuration pins, power supply, ground, and various other specialized signals for programming and interfacing. The FPGA can support multiple I/O standards and features programmable logic resources for implementing custom digital circuits. The device is used in various applications such as communications, automotive, industrial, and consumer electronics, providing flexibility and performance for diverse design requirements.

Manufacturer

The XC3S400-4FGG456C is manufactured by Xilinx, Inc., which is a leading company in the field of programmable logic devices and FPGAs (Field-Programmable Gate Arrays). Founded in 1984 and headquartered in San Jose, California, Xilinx specializes in advanced semiconductor solutions that enable designers to create custom hardware for a wide range of applications, including telecommunications, automotive, industrial, and consumer electronics. Xilinx is known for its innovation in adaptive and intelligent computing, providing products that help engineers to improve performance and efficiency in their designs. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing.

Application

The XC3S400-4FGG456C, part of Xilinx's Spartan-3 family, is commonly used in applications such as digital signal processing, embedded systems, industrial automation, telecommunications, automotive electronics, and consumer electronics. Its low power consumption and versatility make it suitable for prototyping, hardware acceleration, and custom logic design in various sectors.

Equivalent

The XC3S400-4FGG456C is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. XC3S200 (lower capacity)
2. XC3S1000 (higher capacity)
3. Lattice ECP2M (similar performance)
4. Altera Cyclone II (similar FPGA family)
For specific applications, consider the specifications and pin compatibility before selection.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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