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XC3S200AN-4FTG256C
IC FPGA 195 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC3S200AN-4FTG256C
- Paquete BGA-256
- Hoja de datos
- En stock7939
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Especificaciones
| Package | Tray |
| Series | Spartan®-3AN |
| ProductStatus | Active |
| NumberofLABs/CLBs | 448 |
| NumberofLogicElements/Cells | 4032 |
| TotalRAMBits | 294912 |
| NumberofI/O | 195 |
| NumberofGates | 200000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-LBGA |
Descripción general
Description
This FPGA comes in a fine-pitch ball grid array (FBGA) package with 256 pins, facilitating high-density interconnections. It supports various I/O standards, making it versatile for different applications. The XC3S200AN includes dedicated digital signal processing (DSP) slices, block RAM, and a rich set of configurable logic blocks, allowing for efficient implementation of complex algorithms and functions.
Ideal for applications in communications, automotive, and consumer electronics, the XC3S200AN-4FTG256C enables rapid prototyping and iterative design due to its reprogrammable nature. It is supported by Xilinx's design tools, including Vivado and ISE, which facilitate easy design entry, simulation, and debugging.
Features
- Logic Cells: 200,000 system gates with 1,440 logic cells, enabling complex designs.
- I/O Pins: 256 I/O pins with support for various I/O standards, including LVTTL, LVCMOS, and others.
- Memory: Up to 128 Kbits of block RAM, allowing for efficient data storage and manipulation.
- DSP Slices: Supports digital signal processing with dedicated DSP slices for high-performance applications.
- Clock Management: Integrated clock management with PLLs to manage clock frequencies and distribution.
- Configuration: Supports JTAG, SPI, and BPI Flash configurations for flexible programming options.
- Power Consumption: Low power consumption, making it suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and simulation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial automation, where cost and performance are critical.
Package
Pinout
The primary functions of the XC3S200AN include digital logic implementation, signal processing, and interfacing with various I/O standards. It supports a range of features such as:
- 200,000 system gates
- 1,536 logic cells
- 100 I/O pins, with support for various voltage levels and standards
- On-chip block RAM
- Digital Signal Processing (DSP) slices
The device is typically used in applications such as communications, automotive, industrial control, and more. The "4" in the designation indicates the speed grade, while "FTG" denotes the package type (Fine Pitch Ball Grid Array).
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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