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XC3S2000-5FGG676C
IC FPGA 489 I/O 676FBGA
- Fabricante
- Mfr. Parte #XC3S2000-5FGG676C
- Paquete BGA-676
- Hoja de datos
- En stock5837
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Especificaciones
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 5120 |
| NumberofLogicElements/Cells | 46080 |
| TotalRAMBits | 737280 |
| NumberofI/O | 489 |
| NumberofGates | 2000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 676-BGA |
Descripción general
Description
Key specifications include a 5-volt tolerant I/O, a maximum clock speed of 200 MHz, and support for various configuration modes. The FPGA is housed in a 676-pin Fine Pitch Ball Grid Array (FBGA) package, ideal for compact designs. Its architecture includes logic cells, DSP slices, and block RAM, allowing for flexible and efficient design implementations.
Developers can leverage Xilinx's ISE Design Suite for design entry, simulation, and synthesis, making it accessible for both novice and experienced users. The XC3S2000 is suitable for applications that require rapid prototyping and high adaptability in hardware design.
Features
1. Logic Cells: Approximately 2 million system gates with 2000 logic cells.
2. Configurable I/O: 576 I/O pins with support for various I/O standards, including LVTTL and LVCMOS.
3. RAM: Up to 144 Kbits of block RAM available for data storage.
4. DSP Slices: Supports digital signal processing with dedicated DSP slices.
5. Speed Grade: Rated at speed grade -5, suitable for high-performance applications.
6. Packages: Available in a FGG package (676-ball grid array), facilitating dense designs.
7. Power Efficiency: Optimized for low power consumption, making it ideal for portable and battery-operated devices.
8. Development Support: Compatible with Xilinx design tools for effective programming and debugging.
This FPGA is well-suited for applications in telecommunications, automotive, and consumer electronics due to its flexibility and performance.
Package
Pinout
The primary functions of the XC3S2000-5FGG676C include:
1. Configurable Logic Blocks (CLBs): It contains a large number of CLBs for implementing custom logic.
2. Digital Signal Processing (DSP): Supports DSP applications with dedicated DSP slices.
3. I/O Capabilities: Offers versatile I/O standards to interface with various peripherals and systems.
4. Memory: Includes Block RAM for data storage and buffering.
5. Multiple Clock Domains: Supports designs requiring complex clock management.
The device is suitable for applications such as consumer electronics, automotive systems, telecommunications, and industrial automation.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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