XC3S2000-4FGG456I

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XC3S2000-4FGG456I

IC FPGA 333 I/O 456FBGA

  • Fabricante
  • Mfr. Parte #XC3S2000-4FGG456I
  • Paquete FBGA-456
  • Hoja de datos
  • En stock6451

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Especificaciones

Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 5120
NumberofLogicElements/Cells 46080
TotalRAMBits 737280
NumberofI/O 333
NumberofGates 2000000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 456-BBGA

Descripción general

Description

The XC3S2000-4FGG456I is a member of the Xilinx Spartan-3 family of Field-Programmable Gate Arrays (FPGAs). It features a capacity of approximately 2 million system gates, making it suitable for various digital applications, including telecommunications, automotive, and consumer electronics. The device operates at a maximum clock frequency of up to 200 MHz and supports multiple I/O standards, allowing for versatile interfacing options.
The "4" in the part number indicates the speed grade, while "FGG456" refers to the package type and pin count—specifically, a Fine-Pitch Ball Grid Array (FBGA) with 456 balls. The XC3S2000 is designed with a rich set of configurable logic blocks, specialized DSP slices, and built-in memory resources, enabling efficient implementation of complex algorithms and designs. It also supports advanced features like embedded processors and communication interfaces. The Spartan-3 series is known for its cost-effectiveness and low power consumption, appealing to developers seeking efficient solutions in various applications.

Features

The XC3S2000-4FGG456I is a member of the Xilinx Spartan-3 family of FPGAs, designed for low-cost, high-performance applications. Key features include:
- Logic Cells: Approximately 2,000 logic cells, providing ample resources for various digital designs.
- I/O Pins: 456 I/O pins that support various I/O standards, facilitating diverse interfacing options.
- Configurable Logic Blocks (CLBs): Each CLB includes flip-flops and look-up tables (LUTs) for implementing combinatorial and sequential logic.
- DSP Slices: Features dedicated DSP slices for efficient signal processing tasks.
- Block RAM: Up to 4.5 Mbits of block RAM for data storage and buffering.
- Clock Management: Integrated clock management features, including clock dividers and phase-locked loops (PLLs).
- Power Consumption: Low power consumption, making it suitable for battery-operated and compact devices.
- Development Support: Compatible with Xilinx development tools for efficient design and debugging processes.
Overall, the XC3S2000-4FGG456I is ideal for embedded systems, communications, and industrial applications.

Package

The XC3S2000-4FGG456I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 456 balls. This type of package provides a compact design and efficient thermal performance, suitable for high-density applications.

Pinout

The XC3S2000-4FGG456I is a member of the Xilinx Spartan-3 family of FPGAs. It features a pin count of 456. The FPGA is designed for high-performance applications and includes various I/O standards, a programmable logic architecture, and embedded block RAM. Its functions include digital signal processing, complex algorithm implementation, and interfacing with various external devices. The specific part number indicates a 4-speed grade and a fine-pitch ball grid array (FBGA) package. This FPGA is suitable for various applications, including telecommunications, industrial automation, and automotive systems.

Manufacturer

The XC3S2000-4FGG456I is manufactured by Xilinx, Inc., a company known for designing and manufacturing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and application-specific integrated circuits (ASICs). Founded in 1984, Xilinx is recognized as a pioneer in the FPGA market and provides solutions for various applications across industries such as telecommunications, automotive, aerospace, defense, and consumer electronics. The company focuses on enabling digital design and offers tools and software for hardware and system development. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in high-performance computing and adaptive computing technologies.

Application

The XC3S2000-4FGG456I is a Spartan-3 FPGA used in a variety of applications, including digital signal processing, embedded systems, telecommunications, automotive electronics, and industrial automation. Its versatility allows for prototyping, hardware acceleration, and implementing custom logic. Additionally, it is employed in educational settings for learning and experimentation in digital design and FPGA programming.

Equivalent

The XC3S2000-4FGG456I is a Spartan-3 FPGA from Xilinx. Equivalent products include the Lattice ECP3 series (e.g., LFE3-150EA), Altera Cyclone III series (e.g., EP3C25), and Microsemi SmartFusion series. These alternatives offer similar FPGA capabilities and performance, suitable for various applications including digital signal processing and embedded systems.

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DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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