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XC3S1600E-5FGG320C
IC FPGA 250 I/O 320FBGA
- Fabricante
- Mfr. Parte #XC3S1600E-5FGG320C
- Paquete
- Hoja de datos
- En stock6170
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Especificaciones
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 663552 |
| Number of I/O | 250 |
| Number of Gates | 1600000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 320-BGA |
| Supplier Device Package | 320-FBGA (19x19) |
| Base Product Number | XC3S1600 |
| Number of Logic Elements/Cells | 33192 |
| Number of LABs/CLBs | 3688 |
Descripción general
Description
This FPGA operates at a maximum clock frequency of 200 MHz and supports multiple I/O standards, making it suitable for various interfacing needs. The "5" in its designation indicates the speed grade, with lower numbers representing faster operation. The 320-pin Fine Pitch Ball Grid Array (FBGA) package offers a compact footprint for space-constrained designs.
Applications of the XC3S1600E include digital signal processing, industrial automation, communications, and consumer electronics. Its combination of reprogrammability, scalability, and performance makes it a popular choice for developers seeking to implement custom hardware solutions without the need for ASIC fabrication.
Features
1. Logic Cells: 1,600 logic cells for implementing complex logic functions.
2. Configurable I/O: Up to 88 I/O pins with support for various voltage standards.
3. Embedded Memory: 16 Kbit of block RAM for data storage and buffering.
4. Digital Signal Processing (DSP): Features 12 dedicated DSP slices for efficient signal processing tasks.
5. Clock Management: Provides multiple clock management resources, including phase-locked loops (PLLs).
6. Low Power Consumption: Designed for energy-efficient operation, making it suitable for battery-powered applications.
7. Development Tools: Compatible with Xilinx ISE Design Suite for design entry, simulation, and implementation.
8. Package: Available in a 320-pin fine-pitch BGA (FGG) package.
This FPGA is ideal for a range of applications, including communications, automotive, and industrial control systems, offering flexibility and scalability in design.
Package
Pinout
The primary functions of the pins include:
1. User I/O: General-purpose input/output pins for interfacing with external devices.
2. Configuration Pins: Pins used for device configuration and setup (e.g., TMS, TDI, TCK).
3. Power Supply Pins: Pins for supplying power (VCC, GND).
4. Clock Pins: Dedicated pins for clock inputs.
5. JTAG Pins: For in-circuit debugging and programming.
This FPGA is designed for various applications, including digital signal processing, embedded systems, and communication systems, providing flexibility in design and implementation.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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