XC3S1600E-4FGG320I

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XC3S1600E-4FGG320I

IC FPGA 250 I/O 320FBGA

  • Fabricante
  • Mfr. Parte #XC3S1600E-4FGG320I
  • Paquete BGA320
  • Hoja de datos
  • En stock6716

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Especificaciones

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 3688
NumberofLogicElements/Cells 33192
TotalRAMBits 663552
NumberofI/O 250
NumberofGates 1600000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 320-BGA

Descripción general

Description

The XC3S1600E-4FGG320I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It features 1.6 million system gates, providing a versatile platform for various digital logic applications. The device operates at a maximum clock speed of 250 MHz and supports a range of I/O standards, making it suitable for high-performance designs.
The "-4" indicates the speed grade, while "FGG320" refers to the package type, which is a fine-pitch ball grid array (FBGA) with 320 balls, facilitating dense circuit layouts. The "I" at the end signifies that the device is industrial grade, capable of functioning in a wider temperature range for robust applications.
Common applications include digital signal processing, communications, and embedded systems, where flexibility and reconfigurability are essential. The XC3S1600E also supports various design tools, such as Xilinx ISE, enabling users to implement complex designs efficiently.

Features

The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx, designed for cost-effective applications. Key features include:
- Logic Cells: 1.6 million system gates with 3,840 logic cells.
- I/O Pins: Up to 232 I/O pins, supporting various I/O standards.
- Memory: 18 Kb Block RAM, providing up to 4.5 Mbits of integrated memory.
- DSP Slices: Includes 8 DSP slices for efficient signal processing.
- Speed Grade: Operates at a speed grade of -4, ensuring high performance for time-sensitive applications.
- Configuration: Supports JTAG, SPI, and other configuration methods.
- Power Consumption: Low power consumption, suitable for battery-operated devices.
- Development Tools: Compatible with Xilinx ISE Design Suite for design and implementation.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems.

Package

The XC3S1600E-4FGG320I is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically with 320 balls. This type of package provides a compact footprint and efficient thermal performance, suitable for high-density applications.

Pinout

The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx, featuring a pin count of 320. It operates in a Fine-Pitch Ball Grid Array (FBGA) package. The device is primarily used for various digital logic applications, including embedded processing, signal processing, and communications.
Key functions of the XC3S1600E include:
1. Logic Capacity: It has a logic cell count of 1,600, allowing for the implementation of complex designs.
2. I/O Capability: Supports multiple I/O standards, providing flexibility for interfacing with other devices.
3. Embedded Block RAM: Contains multiple kilobits of block RAM for data storage and processing.
4. DSP Slices: Equipped with DSP slices for efficient arithmetic operations.
5. Configuration Options: Supports several configuration modes, including JTAG and serial modes.
This FPGA is widely used in applications requiring high performance and flexibility.

Manufacturer

The manufacturer of the XC3S1600E-4FGG320I is Xilinx, Inc., which is a leading semiconductor company headquartered in San Jose, California. Xilinx specializes in designing and developing programmable logic devices, including Field-Programmable Gate Arrays (FPGAs), Complex Programmable Logic Devices (CPLDs), and System on Chips (SoCs). The XC3S1600E is part of the Spartan-3E family of FPGAs, known for their cost-effectiveness and performance in various applications such as communications, automotive, industrial, and consumer electronics.
Xilinx plays a pivotal role in the electronics industry by providing solutions that enable designers to create customizable hardware and software systems. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in the field of high-performance computing and adaptive computing solutions.

Application

The XC3S1600E-4FGG320I is a Spartan-3E FPGA used in various applications such as digital signal processing, embedded systems, communications, industrial automation, automotive electronics, and consumer electronics. Its versatility supports prototyping, hardware acceleration, and custom logic implementations in fields like imaging, video processing, and control systems.

Equivalent

The XC3S1600E-4FGG320I is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3-70: Another FPGA family offering similar features.
2. Altera Cyclone III EP3C16: Comparable in logic density and performance.
3. Microsemi SmartFusion: A mixed-signal FPGA with similar capabilities.
When selecting alternatives, consider specific application requirements like I/O count, speed, and power consumption.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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