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XC3S1600E-4FGG320C
IC FPGA 250 I/O 320FBGA
- Fabricante
- Mfr. Parte #XC3S1600E-4FGG320C
- Paquete 320FBGA
- Hoja de datos
- En stock6263
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Especificaciones
| Package | Tray |
| Series | Spartan®-3E |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3688 |
| NumberofLogicElements/Cells | 33192 |
| TotalRAMBits | 663552 |
| NumberofI/O | 250 |
| NumberofGates | 1600000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 320-BGA |
Descripción general
Description
With a 90nm process technology, the XC3S1600E can operate at speeds up to 400 MHz, delivering a balance of performance and power efficiency. It supports various I/O standards, such as LVTTL and LVCMOS, allowing flexibility in interfacing with other components.
Key features include an extensive library of pre-built IP cores, integrated DSP slices for efficient arithmetic operations, and advanced configuration options, including JTAG and SPI. The FPGA is also supported by Xilinx's ISE Design Suite for development, simulation, and implementation, simplifying the design process. Overall, the XC3S1600E-4FGG320C is a versatile choice for applications requiring reliable, programmable logic solutions.
Features
1. Logic Cells: Up to 1,600 logic cells for flexible programmable logic.
2. I/O Pins: 32 I/O pins with support for various I/O standards.
3. Memory: Integrated block RAM (up to 576 Kbits) and distributed RAM for efficient data storage.
4. DSP Slices: Equipped with DSP slices for high-performance digital signal processing.
5. Flexible Configuration: Supports multiple configuration modes including JTAG and serial configurations.
6. Operating Voltage: Typically operates at a voltage of 1.2V for core and 3.3V for I/O.
7. Package: Available in a 320-pin Fine Pitch Ball Grid Array (FBGA) package.
8. Performance: Capable of operating at a maximum clock frequency of around 250 MHz.
These features position the XC3S1600E-4FGG320C as a versatile solution for applications in consumer electronics, automotive, and industrial automation.
Package
Pinout
The functionality of the XC3S1600E includes configurable logic blocks (CLBs), digital signal processing (DSP) slices, block RAM, and embedded multipliers. It supports various I/O standards and features such as JTAG for programming and debugging, making it suitable for a range of applications including communications, automotive, and consumer electronics. The FPGA can be programmed to implement custom logic and perform complex computations, allowing for flexibility in design.
Manufacturer
Application
Equivalent
1. Lattice ECP3 series (e.g., LFE3-35EA).
2. Altera Cyclone III series (e.g., EP3C16).
3. Intel MAX 10 series (e.g., 10M08SAE144C8G).
These alternatives offer comparable performance and features for similar applications.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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