XC3S1500-4FG676I

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XC3S1500-4FG676I

IC FPGA 487 I/O 676FCBGA

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  • Mfr. Parte #XC3S1500-4FG676I
  • Paquete
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  • En stock3187

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Especificaciones

Series Spartan®-3
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 29952
Total RAM Bits 589824
Number of I/O 487
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 676-BGA
Supplier Device Package 676-FBGA (27x27)
Base Product Number XC3S1500
Number of LABs/CLBs 3328
Number of Gates 1500000

Descripción general

Description

The XC3S1500-4FG676I is a member of the Xilinx Spartan-3 family of field-programmable gate arrays (FPGAs). This device features 1.5 million system gates, making it suitable for a wide range of applications, including digital signal processing, embedded systems, and various types of logic processing.
The "4" in the part number indicates the speed grade, which signifies the performance level of the FPGA, while "FG676" refers to the package type and size, specifically a Fine-Pitch Ball Grid Array (FBGA) with 676 balls. The "I" indicates that it operates at an industrial temperature range, making it suitable for harsher environments.
Key features of the XC3S1500-4FG676I include abundant I/O pins, various configuration modes, and support for multiple voltage levels. It is programmable using the Xilinx design suite, which includes tools for synthesis, simulation, and debugging, allowing engineers to implement complex designs efficiently. The Spartan-3 series is known for its low cost and low-power consumption, making it ideal for cost-sensitive applications.

Features

The XC3S1500-4FG676I is a Spartan-3 FPGA from Xilinx, designed for low-cost, low-power applications. Key features include:
- Logic Cells: Up to 1,500 logic cells, supporting complex designs.
- I/O Pins: 676-ball grid array (BGA) package with multiple I/O options for flexibility.
- Embedded Memory: Up to 512 Kbits of block RAM for data storage.
- DSP Slices: Integrated DSP slices for efficient signal processing.
- Configuration Options: Supports various configuration methods, including JTAG and serial modes.
- Power Efficiency: Operates at low power, ideal for portable applications.
- High-Speed Performance: Capable of running at speeds up to 200 MHz.
- Development Tools: Compatible with Xilinx ISE design suite for efficient design and simulation.
The XC3S1500-4FG676I is suitable for applications in communications, automotive, consumer electronics, and industrial control.

Package

The XC3S1500-4FG676I is a Spartan-3 FPGA from Xilinx, packaged in a Fine-Pitch Ball Grid Array (FBGA) format with 676 balls. This package type provides a compact design and efficient thermal performance, making it suitable for various applications.

Pinout

The XC3S1500-4FG676I is a Field Programmable Gate Array (FPGA) from the Xilinx Spartan-3 family. It has a pin count of 676.
The primary functions of the XC3S1500-4FG676I include:
1. Digital Logic Implementation: Supports a wide range of digital logic designs, from simple combinatorial functions to complex state machines.
2. I/O Configuration: Offers versatile I/O capabilities, enabling connection with various peripherals and interfaces (e.g., GPIO, SPI, I2C).
3. High-Speed Transceivers: Supports multiple high-speed communication protocols.
4. Resource Flexibility: Features a configurable architecture allowing for optimization based on specific application needs.
This FPGA is often utilized in applications such as telecommunications, automotive, industrial control, and embedded systems due to its balance of performance, resource availability, and cost-effectiveness.

Manufacturer

The manufacturer of the XC3S1500-4FG676I is Xilinx, Inc. Xilinx is a technology company that specializes in the development of programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and software tools for hardware design. Founded in 1984, Xilinx is known for pioneering the FPGA technology, which allows designers to configure chip architecture to meet specific application needs. The company serves a wide range of industries, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further expanding its capabilities in the semiconductor market.

Application

The XC3S1500-4FG676I is a Spartan-3 FPGA used in various applications, including digital signal processing, telecommunications, automotive systems, industrial automation, medical devices, and consumer electronics. Its versatility allows for custom logic design, data processing, and interfacing with other devices, making it suitable for prototyping, embedded systems, and real-time processing tasks.

Equivalent

The XC3S1500-4FG676I is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3 - Similar performance and capacity.
2. Altera Cyclone III - Comparable features and applications.
3. Xilinx Spartan-6 - Improved performance with a similar architecture.
Ensure to assess specific requirements like I/O count, power consumption, and performance metrics for your application.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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