XC3S1500-4FG676C

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XC3S1500-4FG676C

IC FPGA 487 I/O 676FCBGA

  • Fabricante
  • Mfr. Parte #XC3S1500-4FG676C
  • Paquete 676-BGA
  • Hoja de datos
  • En stock3100

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Especificaciones

Supplier AMD Xilinx
Package Tray
Series Spartan®-3
ProductStatus Active
NumberofLABs/CLBs 3328
NumberofLogicElements/Cells 29952
TotalRAMBits 589824
NumberofI/O 487
NumberofGates 1500000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 676-BGA

Descripción general

Description

XC3S1500-4FG676C is a Xilinx Spartan-3S FPGA. It targets cost‑sensitive, mid/high‑density digital logic. The device integrates roughly 1.5 million system gates (LEs), plus distributed RAM blocks, DSP slices, and clock management PLLs. The -4 denotes the speed grade (one of the slower timing variants). The FG676C package is a FineLine BGA with 676 pins, enabling a large number of I/O across several banks and supporting multiple I/O standards. It’s programmed via JTAG or SPI, and designs are created in Xilinx ISE (or older Vivado WebPACK) using HDL (Verilog/VHDL) with constraints in a UCF file. Typical uses include embedded controllers, DSP/data-path processing, custom peripherals, and interface hardware. Note: Spartan-3 is an older family; for new designs consider Spartan-6 or 7-series FPGAs.

Features

XC3S1500-4FG676C is a Xilinx Spartan-3S FPGA (SRAM-based) in a 676-pin FineLine BGA, speed grade -4. Key features:
- 90 nm Spartan-3S architecture with dense LUT-based logic and fast carry logic
- On-chip memory: block RAM (M4K blocks) plus distributed RAM
- DSP capability via dedicated multipliers for signal processing
- Clocking: clock-management with DCMs/PLLs for flexible timing
- I/O: abundant multi-voltage I/O in multiple banks, supporting common standards (LVCMOS/LVTTL, SSTL/HSTL, etc.)
- Reconfigurable, SRAM-based fabric with JTAG boundary-scan
- Suitable for general logic, DSP, data path, and embedded glue logic
- Package: FG676C (676-pin FineLine BGA) for high I/O density and routing
Note: for exact resource counts (logic cells, BRAM, DSP slices) and electrical specs, consult the official Xilinx XC3S1500-4FG676C datasheet.

Package

FineLine BGA package, FG676 (676 balls). The -4FG676C suffix denotes the FG676C variant of the FG676 package.

Pinout

- Pin count: 676 pins (FG676 package)
- Function: Xilinx XC3S1500-4FG676C is a Spartan-3 FPGA (1500 logic cell) in a 676-pin package, a general-purpose, reconfigurable digital logic device with I/O, RAM blocks, multipliers, etc.

Manufacturer

- Manufacturer: Xilinx, Inc. (now part of AMD)
- What kind of company: A multinational semiconductor company that designs and manufactures programmable logic devices, primarily FPGAs and CPLDs, plus related IP, software, and other integrated circuits.

Application

XC3S1500-4FG676C is a Spartan-6 FPGA. Typical applications include:
- Digital signal processing and filtering
- Embedded control and I/O interfaces (motor control, power management, sensors)
- Industrial automation and process control
- Communications and networking interface logic
- Data acquisition, instrumentation and test equipment
- Prototyping, education, and cost-sensitive custom logic
- Low- to mid-range video/image processing and consumer electronics front-end

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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