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XC3S1500-4FG456I
IC FPGA 333 I/O 456FBGA
- Fabricante
- Mfr. Parte #XC3S1500-4FG456I
- Paquete 456-BBGA
- Hoja de datos
- En stock7911
100% original & Nuevo
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Especificaciones
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 3328 |
| NumberofLogicElements/Cells | 29952 |
| TotalRAMBits | 589824 |
| NumberofI/O | 333 |
| NumberofGates | 1500000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 456-BBGA |
Descripción general
Description
The package type, "FG456," refers to a Fine-Pitch BGA (Ball Grid Array) with 456 pins, allowing for extensive I/O connectivity. It supports various I/O voltages and standards, making it adaptable for interfacing with different components. The XC3S1500 is ideal for applications in automotive, industrial, and consumer electronics, as well as for prototyping and educational purposes.
Key features include built-in memory blocks, high-speed DSP slices for signal processing, and a rich set of programmable logic resources. The FPGA can be configured using VHDL or Verilog, making it flexible for developers. Overall, the XC3S1500-4FG456I is a reliable choice for implementing custom digital designs efficiently.
Features
- Logic Cells: 1,500 logic cells, allowing for a broad range of applications.
- Configurable I/O: Up to 232 I/O pins, supporting various I/O standards, including LVTTL and LVCMOS.
- Embedded Memory: Includes up to 512 Kbits of block RAM for data storage.
- DSP Slices: Equipped with dedicated DSP slices for high-performance digital signal processing tasks.
- Clock Management: Features clock management tiles with phase-locked loop (PLL) for clock generation and distribution.
- Configuration Options: Supports multiple configuration methods, including JTAG, SPI, and parallel modes.
- Power Efficiency: Designed for low power consumption, making it suitable for battery-operated devices.
- Package: Available in a 456-pin Fine Pitch Ball Grid Array (FBGA) package.
These features make the XC3S1500-4FG456I suitable for a variety of applications, including consumer electronics, automotive, and communication systems.
Package
Pinout
1. I/O Pins: Configurable input/output pins that can be used for interfacing with external devices.
2. Power Supply Pins: For connecting to the necessary power supplies, including VCC and ground.
3. Configuration Pins: Used for programming the FPGA, including JTAG and other configuration modes.
4. Dedicated Clock Pins: For clock signals to synchronize operations within the FPGA.
5. Internal Logic Interconnects: Not directly exposed but utilized for routing signals within the chip.
The XC3S1500-4FG456I supports various applications in digital signal processing, embedded systems, and custom hardware solutions.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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