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XC3S1200E-5FTG256C
IC FPGA 190 I/O 256FTBGA
- Fabricante
- Mfr. Parte #XC3S1200E-5FTG256C
- Paquete
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Especificaciones
| Series | Spartan®-3E |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 516096 |
| Number of I/O | 190 |
| Number of Gates | 1200000 |
| Voltage - Supply | 1.14V ~ 1.26V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Base Product Number | XC3S1200 |
| Number of Logic Elements/Cells | 19512 |
| Number of LABs/CLBs | 2168 |
Descripción general
Description
This FPGA supports various I/O standards, including LVTTL and LVCMOS, making it versatile for different interfacing needs. The device comes in a fine-pitch TQFP package, facilitating compact designs in space-constrained environments.
The Spartan-3E series is known for its comprehensive configuration options and built-in digital signal processing (DSP) capabilities, making it suitable for applications in telecommunications, automotive systems, and consumer electronics. It also includes embedded block RAM and multipliers, enhancing its functionality for complex computational tasks.
Overall, the XC3S1200E-5FTG256C is an ideal choice for designers seeking a balance of performance, power efficiency, and cost-effectiveness in their FPGA applications.
Features
1. Logic Cells: 1,200 logic cells, providing a flexible architecture for digital design.
2. Configurable I/O: 256 I/O pins, supporting various voltage standards and configurations.
3. High-Speed Performance: Operates at a maximum clock frequency of 200 MHz.
4. Block RAM: Up to 4 Mbits of embedded block RAM for efficient data storage and processing.
5. DSP Slices: Integrated DSP (Digital Signal Processing) capabilities for complex arithmetic operations.
6. Built-in JTAG Support: Facilitates easy programming and debugging.
7. Power Efficiency: Optimized for low power consumption, suitable for battery-operated devices.
8. Development Tools: Compatible with Xilinx ISE design software for streamlined development.
9. Package Type: Available in a Fine Pitch Ball Grid Array (FBGA) package for compact designs.
This FPGA is ideal for a wide range of applications, including automotive, industrial control, and consumer electronics.
Package
Pinout
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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