XC3S1200E-4FGG400I

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XC3S1200E-4FGG400I

IC FPGA 304 I/O 400FBGA

  • Fabricante
  • Mfr. Parte #XC3S1200E-4FGG400I
  • Paquete BGA-400
  • Hoja de datos
  • En stock7496

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Especificaciones

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 2168
NumberofLogicElements/Cells 19512
TotalRAMBits 516096
NumberofI/O 304
NumberofGates 1200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 400-BGA

Descripción general

Description

The XC3S1200E-4FGG400I is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family, designed for a variety of digital logic applications. This device features a capacity of approximately 1,200 logic cells, making it suitable for medium-density designs.
Key specifications include a 400-ball Fine Pitch Ball Grid Array (FBGA) package, an operating voltage of 1.2V, and a maximum clock speed of around 200 MHz. The FPGA is equipped with enhanced DSP (Digital Signal Processing) capabilities, making it ideal for applications in signal processing, embedded systems, and digital communication.
The XC3S1200E offers a rich set of I/O options, including general-purpose and dedicated high-speed transceivers, alongside a variety of configuration mechanisms. It supports the Xilinx ISE Design Suite for development, enabling users to implement complex functionalities using hardware description languages like VHDL and Verilog. With its balance of performance, power efficiency, and flexibility, the XC3S1200E is widely utilized in industrial, automotive, and consumer electronic applications.

Features

The XC3S1200E-4FGG400I is a member of Xilinx's Spartan-3E FPGA family, designed for a range of applications including consumer electronics, automotive, and industrial controls. Key features include:
1. Logic Cells: 1,200 logic cells, allowing for efficient implementation of complex designs.
2. I/O Pins: Up to 232 user I/O pins, supporting various voltage standards and configurations.
3. Configurable Logic Blocks (CLBs): Each CLB contains flip-flops and look-up tables, enabling versatile logic functions.
4. Memory: Integrated block RAM of up to 6 Kbits per block, providing on-chip storage.
5. Digital Signal Processing (DSP): Optional DSP slices for high-performance arithmetic operations.
6. Performance: Supports a maximum clock frequency of up to 200 MHz.
7. Power Efficiency: Low power consumption, suitable for battery-operated devices.
8. Package: Available in a 400-ball fine-pitch ball grid array (FBGA) package, facilitating compact designs.
Overall, the XC3S1200E-4FGG400I is ideal for applications requiring moderate complexity with a focus on cost-effectiveness and power efficiency.

Package

The XC3S1200E-4FGG400I is packaged in a 400-ball Fine Pitch Ball Grid Array (FBGA) format. This package type provides a compact design suitable for high-density applications, facilitating efficient thermal management and electrical performance.

Pinout

The XC3S1200E-4FGG400I is a Spartan-3E FPGA from Xilinx with a pin count of 400. It belongs to the FGG (Fine-Pitch Ball Grid Array) package type. This FPGA is designed for various applications, including digital signal processing, embedded systems, and communications.
The device features multiple I/O banks, allowing for a wide range of I/O standards and configurations. The XC3S1200E includes programmable logic, embedded multipliers, and distributed RAM, enabling complex logic functions and high-performance processing capabilities. It also supports various configuration methods, including JTAG and master serial mode, facilitating easy integration into designs.
Overall, the XC3S1200E is well-suited for cost-sensitive applications requiring moderate logic capacity and performance.

Manufacturer

The XC3S1200E-4FGG400I is manufactured by Xilinx, Inc., a company known for its development of programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and associated software tools. Founded in 1984, Xilinx is a leading provider in the semiconductor industry, focusing on innovative solutions for a range of applications including telecommunications, automotive, aerospace, and consumer electronics. The company's products are used in various sectors that require high-performance and flexible hardware solutions. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further enhancing its capabilities and market reach in the semiconductor field.

Application

The XC3S1200E-4FGG400I is a Field Programmable Gate Array (FPGA) from Xilinx, widely used in various application areas including digital signal processing, telecommunications, automotive systems, industrial control, and consumer electronics. It supports custom hardware designs for prototyping, embedded systems, and high-speed data processing tasks. Its flexibility allows for implementation in applications requiring real-time processing and adaptability.

Equivalent

The XC3S1200E-4FGG400I is a Spartan-3 FPGA from Xilinx. Equivalent products include:
1. Lattice ECP3: ECP3-70 or ECP3-150 FPGAs
2. Altera Cyclone III: EP3C120F484C6
3. Microsemi SmartFusion: M2S050-FGG484
These alternatives vary in specifications, so check compatibility for specific applications.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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