XC3S1200E-4FGG400C

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XC3S1200E-4FGG400C

IC FPGA 304 I/O 400FBGA

  • Fabricante
  • Mfr. Parte #XC3S1200E-4FGG400C
  • Paquete FBGA-400
  • Hoja de datos
  • En stock7893

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Especificaciones

Package Tray
Series Spartan®-3E
ProductStatus Active
NumberofLABs/CLBs 2168
NumberofLogicElements/Cells 19512
TotalRAMBits 516096
NumberofI/O 304
NumberofGates 1200000
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature 0°C ~ 85°C (TJ)
Package/Case 400-BGA

Descripción general

Description

The XC3S1200E-4FGG400C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. Designed for cost-sensitive applications, it features 1,200 logic cells, 78,000 system gates, and is optimized for high performance and low power consumption. The FPGA is housed in a 400-pin Fine Pitch Ball Grid Array (FBGA) package.
Key features include:
- Programmable Logic Blocks: Configurable logic resources to implement various digital functions.
- I/O Capabilities: Supports multiple I/O standards, facilitating connections to different devices.
- On-chip Memory: Offers distributed RAM and block RAM for data storage.
- Digital Signal Processing (DSP): Includes dedicated DSP slices for efficient signal processing tasks.
The XC3S1200E is suitable for a variety of applications, including telecommunications, automotive, industrial automation, and consumer electronics, providing flexibility and adaptability in design. It is programmed using hardware description languages like VHDL or Verilog, enabling users to customize and deploy their digital systems efficiently.

Features

The XC3S1200E-4FGG400C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. Key features include:
1. Capacity: 1,200 logic cells, enabling complex designs.
2. I/O Pins: Up to 376 I/O pins, supporting various I/O standards.
3. Memory: 36 Kbits of block RAM, ideal for data storage and buffering.
4. DSP Slices: Contains dedicated DSP slices for efficient digital signal processing.
5. Speed Grade: Operates at a speed grade of -4, suitable for moderate-speed applications.
6. Voltage: Operates at a core voltage of 1.2V, with I/O options typically at 3.3V.
7. Configuration Options: Supports multiple configuration methods, including JTAG and serial.
8. Embedded Features: Includes integrated features like clock management and multiplexers for enhanced performance.
9. Development Tools: Compatible with Xilinx's ISE design suite for streamlined development.
This FPGA is ideal for applications in communications, automotive, and industrial control systems, offering flexibility and performance for diverse tasks.

Package

The XC3S1200E-4FGG400C is packaged in a Fine-Pitch Ball Grid Array (FBGA) with 400 balls. This package type is designed for high-density applications, providing excellent thermal performance and signal integrity.

Pinout

The XC3S1200E-4FGG400C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It features a pin count of 400 pins in a Fine Pitch Ball Grid Array (FBGA) package.
Key functions of this FPGA include:
- Configurable logic blocks for implementing custom digital logic.
- Dedicated input/output (I/O) pins that can be configured for various signaling standards.
- Support for DSP (Digital Signal Processing) functions.
- High-speed serial communication capabilities.
- On-chip memory resources for storage and buffering.
This FPGA is used in applications that require flexibility in hardware design, such as communications, automotive systems, and industrial controls.

Manufacturer

The manufacturer of the XC3S1200E-4FGG400C is Xilinx, Inc. Xilinx is a leading technology company that specializes in designing and manufacturing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and system-on-chip (SoC) solutions. Founded in 1984, Xilinx was a pioneer in FPGA technology and has played a significant role in the development of adaptable hardware for a variety of applications, including telecommunications, automotive, aerospace, and consumer electronics. In October 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities and product offerings in the semiconductor industry.

Application

The XC3S1200E-4FGG400C is a Spartan-3E FPGA used in various applications, including digital signal processing, embedded systems, telecommunications, automotive, and industrial control. Its versatility allows for custom logic design, interfacing with sensors and actuators, and implementing complex algorithms. It is also suitable for prototyping, robotics, and consumer electronics, enabling rapid development and integration of hardware solutions.

Equivalent

The XC3S1200E-4FGG400C chip is a Spartan-3E FPGA from Xilinx. Equivalent products include:
1. Xilinx XC6SLX16 - Spartan-6 family, offers higher performance.
2. Altera EP2C20 - Cyclone II FPGA, similar device density.
3. Lattice ECP3 - ECP3-70, competitive in price/performance.
Always verify specific requirements such as I/O count, speed grade, and power consumption when selecting alternatives.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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