XC3S1200E-4FGG320C

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XC3S1200E-4FGG320C

IC FPGA 250 I/O 320FBGA

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  • Mfr. Parte #XC3S1200E-4FGG320C
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  • En stock2095

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Especificaciones

Series Spartan®-3E
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 19512
Total RAM Bits 516096
Number of I/O 250
Voltage - Supply 1.14V ~ 1.26V
Mounting Type Surface Mount
Operating Temperature 0°C ~ 85°C (TJ)
Package / Case 320-BGA
Supplier Device Package 320-FBGA (19x19)
Base Product Number XC3S1200
Number of LABs/CLBs 2168
Number of Gates 1200000

Descripción general

Description

The XC3S1200E-4FGG320C is a field-programmable gate array (FPGA) from Xilinx's Spartan-3E family. This device is designed for cost-sensitive applications requiring moderate performance and flexibility. It features 1,200 logic cells, making it suitable for a variety of digital processing tasks and embedded applications.
The FPGA operates at a core voltage of 1.2V and supports a wide range of I/O standards. It includes 320 pins in a fine-pitch ball grid array (FBGA) package, allowing for high-density designs. The XC3S1200E also provides built-in features such as digital signal processing (DSP) slices, block RAM, and support for various communication interfaces.
With its programmable architecture, developers can customize the FPGA for specific application requirements in industries like telecommunications, automotive, and consumer electronics. Additionally, Xilinx offers a comprehensive development environment, making it easier for designers to implement and test their designs efficiently.

Features

The XC3S1200E-4FGG320C is a FPGA (Field Programmable Gate Array) from Xilinx's Spartan-3E series. Key features include:
- Logic Cells: 1,200 configurable logic cells providing a balance of performance and flexibility.
- I/O Pins: Up to 232 user I/O pins with support for various I/O standards (LVCMOS, LVTTL, etc.).
- Memory: 576 Kbits of block RAM for data storage, and 4 Kbits of distributed RAM for low-latency applications.
- DSP Slices: Equipped with DSP slices for efficient digital signal processing tasks.
- Package: Available in a 320-pin FGG package, allowing for a compact design.
- Clock Management: Integrated clock management features including phase-locked loops (PLLs) and clock dividers.
- Power Efficiency: Operates at a low power supply voltage (1.2V), making it suitable for battery-powered applications.
- Configuration: Supports various configuration methods, including JTAG and SPI.
Ideal for applications in telecommunications, automotive, and industrial control systems, this FPGA offers a blend of performance, flexibility, and efficiency.

Package

The XC3S1200E-4FGG320C is packaged in a Fine Pitch Ball Grid Array (FBGA) format, specifically a 320-ball configuration. This package type is designed for high-density applications, offering excellent thermal and electrical performance.

Pinout

The XC3S1200E-4FGG320C is a Field Programmable Gate Array (FPGA) from Xilinx's Spartan-3E family. It has a total pin count of 320 pins.
The functions of these pins include:
1. I/O Pins: Configurable for various I/O standards, supporting both single-ended and differential signaling.
2. Power Pins: Dedicated pins for power supply (VCC) and ground (GND).
3. Configuration Pins: Used for loading the FPGA configuration, including the JTAG pins for programming and debugging.
4. Clock Pins: Dedicated pins for global clock distribution to synchronize operations within the FPGA.
5. User-defined Pins: Can be used for general-purpose I/O or other specific functions as defined in the FPGA design.
This device is suitable for various applications requiring moderate logic density and flexibility.

Manufacturer

The XC3S1200E-4FGG320C is manufactured by Xilinx, Inc. Xilinx is a semiconductor company that specializes in developing programmable logic devices, including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and software design tools. Founded in 1984, Xilinx is known for pioneering the FPGA technology, which allows designers to create customizable hardware solutions for a wide range of applications, including telecommunications, automotive, aerospace, and consumer electronics. In 2020, Xilinx was acquired by AMD (Advanced Micro Devices), further expanding its capabilities in the semiconductor market.

Application

The XC3S1200E-4FGG320C is a Spartan-3E FPGA commonly used in applications such as embedded systems, digital signal processing, image processing, automotive systems, industrial automation, and communications. Its versatility allows for custom hardware accelerations, rapid prototyping, and the implementation of complex algorithms in fields like robotics and consumer electronics.

Equivalent

The XC3S1200E-4FGG320C is a Spartan-3E FPGA from Xilinx. Equivalent products from other manufacturers include the Altera Cyclone III series (e.g., EP3C25), Lattice ECP3 series (e.g., LFE3-35), and Microsemi IGLOO series (e.g., IGLOO2). These alternatives offer similar performance, I/O counts, and power characteristics suitable for similar applications.

Envío

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DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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