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XC3S1000-4FGG320I
IC FPGA 221 I/O 320FBGA
- Fabricante
- Mfr. Parte #XC3S1000-4FGG320I
- Paquete FBGA-320
- Hoja de datos
- En stock5624
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Especificaciones
| Package | Tray |
| Series | Spartan®-3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 1920 |
| NumberofLogicElements/Cells | 17280 |
| TotalRAMBits | 442368 |
| NumberofI/O | 221 |
| NumberofGates | 1000000 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | -40°C ~ 100°C (TJ) |
| Package/Case | 320-BGA |
Descripción general
Description
The "4" in its designation indicates a speed grade, with lower numbers corresponding to higher performance, while "FGG320" refers to its package type and pin count, which is a fine-pitch ball grid array (FBGA) with 320 balls. Its architecture supports advanced configuration options, allowing for quick reprogramming and prototyping of digital circuits. Typical applications include embedded systems, consumer electronics, and communication devices. Overall, the XC3S1000-4FGG320I is favored for its adaptability, moderate resource availability, and efficient power consumption, making it a popular choice among designers.
Features
1. Logic Cells: Approximately 1,000 logic cells, enabling a range of digital processing tasks.
2. Embedded Memory: Up to 576 Kbits of distributed RAM and support for block RAMs.
3. I/O Ports: 320 I/O pins with flexible I/O standards, supporting various voltage levels (3.3V, 2.5V, 1.8V).
4. Clock Management: Integrated Phase-Locked Loops (PLLs) for clock management and distribution.
5. Configuration: Multiple configuration options including JTAG, serial, and parallel modes.
6. Packages: Available in a 320-ball Fine Pitch Ball Grid Array (FBGA) package, optimizing space and thermal performance.
7. Development Tools: Compatible with Xilinx development tools such as ISE, enabling rapid prototyping and design debugging.
This FPGA is ideal for applications in communications, automotive, industrial, and consumer electronics.
Package
Pinout
The function of these pins includes:
- Power Supply Pins: For VCC and GND connections.
- I/O Pins: Configurable as input, output, or bidirectional for interfacing with external devices.
- Clock Pins: Dedicated pins for clock signals.
- Configuration Pins: Used for loading the configuration data into the FPGA.
- Special Function Pins: These may include JTAG pins for boundary scan and programming, as well as dedicated pins for internal functions like feedback loops.
The XC3S1000 is suitable for diverse applications such as communications, automotive, and industrial control systems, owing to its flexibility and programmable nature.
Manufacturer
Application
Equivalent
- Lattice Semiconductor's LatticeECP3 series
- Intel's Cyclone III series
- Microchip's IGLOO series
These alternatives offer similar performance and capabilities, suitable for applications requiring low power and cost-effective solutions. Always check specific features and compatibility for your application.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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