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XC2V3000-4FF1152I
IC FPGA 720 I/O 1152FCBGA
- Fabricante
- Mfr. Parte #XC2V3000-4FF1152I
- Paquete
- Hoja de datos XC2V3000-4FF1152I DataSheet
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Especificaciones
| Series | Virtex®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 1769472 |
| Number of I/O | 720 |
| Number of Gates | 3000000 |
| Voltage - Supply | 1.425V ~ 1.575V |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Package / Case | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FCBGA (35x35) |
| Base Product Number | XC2V3000 |
| Number of LABs/CLBs | 3584 |
Descripción general
Description
The package type "FF1152" refers to a Fine Pitch Ball Grid Array (FBGA) with 1,152 balls, allowing for a compact design and efficient heat dissipation. The "I" at the end signifies the industrial temperature range, making it suitable for applications in harsh environments.
Key features include high-speed performance, advanced DSP capabilities, and support for multiple I/O standards. The XC2V3000 is commonly used in telecommunications, automotive, and aerospace applications, where flexibility and reliability are crucial. Its programmability allows for rapid prototyping and design iterations, making it a popular choice among engineers and developers.
Features
1. Logic Cells: It contains approximately 3,000 logic cells, which allow for complex digital designs.
2. Embedded Memory: Up to 128 Kbits of block RAM facilitates efficient data storage and manipulation.
3. I/O Capabilities: Supports up to 152 user-configurable I/O pins with various voltage levels.
4. High Performance: Operates at a maximum clock frequency of around 200 MHz, enabling fast processing.
5. Configurable Resources: Includes DSP slices for high-performance arithmetic operations.
6. Power Management: Designed for low power consumption, suitable for portable applications.
7. Package: Housed in a Fine Pitch Ball Grid Array (FBGA) package for compact integration.
8. Development Support: Compatible with Xilinx development tools for design, simulation, and debugging.
This combination of features makes the XC2V3000-4FF1152I suitable for a wide range of applications, from telecommunications to embedded systems.
Package
Pinout
The device is designed for high-performance applications and includes various functionalities such as configurable logic blocks, digital signal processing (DSP) slices, embedded memory, and multiple I/O options. The "4" in the part number indicates the speed grade, which affects performance characteristics. The "FF" indicates the package type, which is a Fine Pitch Ball Grid Array (FBGA). The "I" at the end signifies that it is an industrial-grade part, suitable for extended temperature ranges.
Overall, the XC2V3000-4FF1152I is suitable for applications requiring high levels of integration and flexibility in logic design.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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