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XC2S50-5FGG256C
IC FPGA 176 I/O 256FBGA
- Fabricante
- Mfr. Parte #XC2S50-5FGG256C
- Paquete FBGA-256
- Hoja de datos
- En stock2849
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Especificaciones
| Package | Tray |
| Series | Spartan®-II |
| ProductStatus | Active |
| NumberofLABs/CLBs | 384 |
| NumberofLogicElements/Cells | 1728 |
| TotalRAMBits | 32768 |
| NumberofI/O | 176 |
| NumberofGates | 50000 |
| Voltage-Supply | 2.375V ~ 2.625V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 256-BGA |
Descripción general
Description
- Family and device: Spartan-2 FPGA, model XC2S50, speed grade -5.
- Package: 256-ball Fine-Grid Grid Array (FGG256C).
- Architecture: ~50K system gates worth of programmable logic (LUTs/FFs), plus distributed RAM and I/O resources for moderate-density designs.
- I/O and voltage: 3.3V I/O domain with multiple I/O banks; designed for cost-sensitive applications.
- Configuration and tooling: programmed with Xilinx ISE (WebPACK often used); Spartan-2 devices are largely legacy and not supported by newer toolchains like Vivado.
- Applications: glue logic, small embedded/custom DSP, instrumentation, and early-generation prototyping.
- Notes: Obsolete by Xilinx standards; availability via legacy distributors; best suited for maintaining or migrating older designs.
Features
- Spartan-2S FPGA with about 50K system gates
- 256-pin FineLine BGA package (FGG256)
- Speed grade -5
- 4-input LUT-based logic with fast carry chains
- Distributed RAM (no dedicated block RAM)
- Multiple I/O banks with standard I/O voltage options (typical 3.3V I/O)
- Global clock networks for efficient timing
- JTAG boundary-scan for programming/debugging
- Suitable for cost-sensitive, mid-range designs requiring moderate I/O and logic density
Package
Pinout
- Function: Xilinx Spartan-2 field-programmable gate array (FPGA), ~50K system gates, in a 256-pin package with -5 speed grade and commercial temperature range.
Manufacturer
About the company: It is a semiconductor company that designs and markets programmable logic devices, primarily FPGAs (and related components such as CPLDs and SoCs). Xilinx historically operates as a fabless semiconductor firm, outsourcing manufacturing to foundries.
Application
- Glue logic and peripheral interfacing for microcontrollers
- DSP-like signal processing (filters, decimation, encoding/decoding)
- PWM/motor control and real-time control loops
- Data acquisition, conditioning and custom ADC/DAC interfaces
- Serial/parallel interfaces (SPI, I2C, UART, and custom buses)
- Video/graphics preprocessing for low-resolution displays
- Prototyping, education and cost-sensitive embedded systems
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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