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XC2S150-6FGG256C
IC FPGA 176 I/O 256FBGA
- Fabricante
- Mfr. Parte #XC2S150-6FGG256C
- Paquete
- Hoja de datos
- En stock6271
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Especificaciones
| Series | Spartan®-II |
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Total RAM Bits | 49152 |
| Number of I/O | 176 |
| Number of Gates | 150000 |
| Voltage - Supply | 2.375V ~ 2.625V |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Package / Case | 256-BGA |
| Supplier Device Package | 256-FBGA (17x17) |
| Base Product Number | XC2S150 |
| Number of Logic Elements/Cells | 3888 |
| Number of LABs/CLBs | 864 |
Descripción general
Description
It comes in a 256-ball Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs and efficient thermal management. The XC2S150 offers flexible I/O options, supporting various voltage levels for interfacing with other components.
This FPGA is widely used in applications such as telecommunications, automotive, consumer electronics, and industrial automation, where customizable logic solutions are critical. Its programmability allows for rapid prototyping and iterative development, making it a popular choice among engineers seeking to implement specific hardware functions without the need for custom ASICs.
Features
1. Logic Cells: 150,000 system gates, enabling complex logic implementations.
2. I/O Pins: Up to 256 I/O pins configurable for various interfaces.
3. Memory: Supports up to 6 Kbits of block RAM, offering on-chip data storage.
4. Performance: Operates at a maximum clock frequency of 200 MHz, suitable for high-speed applications.
5. Power Consumption: Low power operation, ideal for battery-powered devices.
6. Configuration: Supports multiple configuration interfaces, including JTAG and serial modes.
7. Design Tools: Compatible with Xilinx ISE design software for efficient development and simulation.
Overall, the XC2S150-6FGG256C is an effective solution for applications in communications, automotive, and industrial control systems, combining flexibility, performance, and cost-efficiency.
Package
Pinout
1. I/O Pins: For general-purpose input/output operations to connect with external devices.
2. Power Supply Pins: For providing power to the FPGA, typically including VCC and ground (GND) connections.
3. Configuration Pins: For configuring the FPGA, which may include JTAG pins and other related signals.
4. Clock Pins: For inputting clock signals necessary for synchronous operations within the FPGA.
This device is designed for applications requiring mid-range logic capacity and is suitable for various digital logic implementations.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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