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XC2C512-10FGG324I
IC CPLD 512MC 9.2NS 324FBGA
- Fabricante
- Mfr. Parte #XC2C512-10FGG324I
- Paquete 324-FBGA
- Hoja de datos
- En stock6991
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Especificaciones
| Package | Tray |
| Series | CoolRunner II |
| ProductStatus | Active |
| ProgrammableType | In System Programmable |
| DelayTimetpd(1)Max | 9.2 ns |
| VoltageSupply-Internal | 1.7V ~ 1.9V |
| NumberofLogicElements/Blocks | 32 |
| NumberofMacrocells | 512 |
| NumberofGates | 12000 |
| NumberofI/O | 270 |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 324-BBGA |
Descripción general
Description
Key specifications include 24 I/O pins, with support for both 3.3V and 5V logic levels, making it adaptable for a wide range of interfacing requirements. The device also incorporates advanced features such as programmable interconnects, built-in clock dividers, and a flexible architecture that allows for ease of design implementation.
The XC2C512 is commonly used in consumer electronics, automotive systems, and industrial applications where quick prototyping and high integration are essential. Its compatibility with Xilinx development tools facilitates efficient design processes, enabling users to leverage its capabilities for complex logic functions.
Features
1. Capacity: 512 macrocells with programmable logic.
2. Speed Grade: Operates at speed grade -10, offering a maximum operating frequency of up to 100 MHz.
3. I/O Pins: 24 I/O pins, configurable for various I/O standards, enabling versatile interfacing options.
4. Power Consumption: Ultra-low power operation, ideal for battery-powered and portable applications.
5. Programmability: Flash-based configuration allows for instant-on capability and reprogrammability.
6. Package: Available in a 324-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
7. Development Tools: Compatible with Xilinx ISE tools for design and synthesis.
These features make the XC2C512-10FGG324I suitable for applications in consumer electronics, automotive systems, and industrial control.
Package
Pinout
Key features include:
- 512 macrocells for logic implementation
- Up to 24 I/O pins available per bank
- Support for multiple I/O standards
- Configurable for various applications like signal processing, control, and interfacing.
The "10" in the part number indicates a maximum operating speed grade of 10, and "FGG" denotes the package type which is a Fine Pitch Ball Grid Array (FBGA). Overall, the XC2C512 serves a wide range of applications in consumer electronics, automotive, and industrial systems.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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