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XC2C256-7FTG256C
IC CPLD 256MC 6.7NS 256FTBGA
- Fabricante
- Mfr. Parte #XC2C256-7FTG256C
- Paquete
- Hoja de datos
- En stock4059
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Especificaciones
| Series | CoolRunner II |
| Part Status | Obsolete |
| Base Product Number | XC2C256 |
| DigiKey Programmable | Not Verified |
| Programmable Type | In System Programmable |
| Delay Time tpd(1) Max | 6.7 ns |
| Voltage Supply - Internal | 1.7V ~ 1.9V |
| Number of Logic Elements/Blocks | 16 |
| Number of Macrocells | 256 |
| Number of I/O | 184 |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 256-LBGA |
| Supplier Device Package | 256-FTBGA (17x17) |
| Packaging | Tray |
| Number of Gates | 6000 |
Descripción general
Description
Key features include low static and dynamic power consumption, built-in memory blocks, and flexible I/O capabilities, enabling designers to implement complex logic functions with ease. The device also supports a range of I/O standards, making it suitable for interfacing with various peripherals. The XC2C256-7FTG256C is ideal for applications requiring rapid prototyping and design iteration due to its reconfigurability. With integrated features for power management and design security, it ensures reliable performance in demanding environments.
Features
1. Capacity: 256 macrocells with a flexible architecture for various logic functions.
2. Speed: Operates at a maximum speed grade of -7, allowing for efficient performance in high-speed applications.
3. Power Consumption: Low power operation, suitable for battery-powered devices and energy-efficient designs.
4. Programmability: Supports in-system programmability, enabling updates and changes post-manufacturing.
5. I/O: 256 I/O pins with support for various voltage levels, including 3.3V and 5V.
6. Configuration: Configurable features such as dedicated flip-flops, multiplexers, and logic gates.
7. Packages: Available in a 256-pin Fine Pitch Ball Grid Array (FBGA) package, facilitating compact designs.
These features make the XC2C256-7FTG256C ideal for applications in consumer electronics, automotive systems, and industrial control.
Package
Pinout
In terms of function, the XC2C256-7FTG256C is designed for low-power applications and provides configurable logic blocks, programmable interconnect, and I/O for implementing custom digital logic designs. It is suitable for applications such as signal processing, control systems, and interface bridging.
The specific package is a TQFP (Thin Quad Flat Package) with 256 pins. This allows for a high number of I/O connections while maintaining a compact footprint, making it ideal for space-constrained designs.
Manufacturer
Application
Equivalent
1. Lattice ispXPLD 4000 Series (e.g., ispXPLD 4000E)
2. Altera MAX 10 Series (e.g., MAX 10 10M08)
3. Microchip SSTL Series (e.g., SSTL 10K)
These alternatives should be evaluated based on specific application requirements, such as I/O count, power consumption, and logic density.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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