XA6SLX25T-2CSG324Q

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XA6SLX25T-2CSG324Q

IC FPGA 190 I/O 324CSBGA

  • Fabricante
  • Mfr. Parte #XA6SLX25T-2CSG324Q
  • Paquete 324-LFBGA, CSPBGA
  • Hoja de datos
  • En stock6253

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Especificaciones

Supplier AMD Xilinx
Package Tray
Series Automotive, AEC-Q100, Spartan®-6 LXT XA
ProductStatus Active
NumberofLABs/CLBs 1879
NumberofLogicElements/Cells 24051
TotalRAMBits 958464
NumberofI/O 190
Voltage-Supply 1.14V ~ 1.26V
MountingType Surface Mount
OperatingTemperature -40°C ~ 125°C (TJ)
Package/Case 324-LFBGA, CSPBGA

Descripción general

Description

XA6SLX25T-2CSG324Q is a Xilinx Spartan-6 FPGA (XC6SLX25T-2CSG324Q). It’s a mid-density, cost‑efficient device in a 324‑ball BGA package (CSG324) and RoHS‑compliant (Q). Key points:
- Family: Spartan-6 LX25T, optimized for logic density with modest I/O and power.
- Density: about 25k logic cells (approximate).
- Speed grade: -2 (mid/high performance within the LX family).
- Features: programmable logic, DSP slices, block RAM, PLLs, and multiple I/O banks for diverse interfaces.
- Typical uses: embedded control, data/path processing, interface glue logic, and other logic-intensive, cost-conscious designs.
- Package/availability: large, dense BGA package suitable for compact boards.
For exact figures (logic cells, BRAM, DSP counts, I/O count, timing, and power), consult the official Xilinx datasheet for XC6SLX25T-2CSG324Q.

Features

XA6SLX25T-2CSG324Q is a Xilinx Spartan-6 LX25T FPGA in a 324-ball CS(G)324 BGA package (lead‑free, RoHS). Key features (typical for Spartan-6 LX):
- ~25K logic cells
- DSP slices for signal processing/MAC operations
- On‑chip BRAM and distributed RAM
- Flexible I/O with multiple banks and I/O standards
- Clock management with PLLs and dedicated carry/logic paths
- Fast carry chains and LUT-based logic
- Low‑power operation suitable for cost‑sensitive designs
- Speed grade -2
Note: exact block RAM, DSP slice count, and I/O capabilities can vary by device revision; this part reflects core Spartan-6 LX25T capabilities in the listed package.

Package

Package type: CSG324, i.e., a 324-pin Ceramic Grid Array package (RoHS-compliant, as indicated by the -Q).

Pinout

- Pin count: 324 pins (CSG324 package)
- Function: Xilinx Spartan-6 LX25T FPGA (field-programmable gate array), ~25K logic cells, used for digital logic and I/O/DSP tasks.

Manufacturer

Manufacturer: Xilinx, Inc. (now a subsidiary of AMD).
What kind of company: An American multinational semiconductor company that designs and sells programmable logic devices, primarily FPGAs (and related SoCs, CPLDs) along with development tools and IP.

Application

Typical application areas for XA6SLX25T-2CSG324Q (Spartan-6 LX25T FPGA):
- Embedded control and system integration (MicroBlaze, peripherals)
- Digital signal processing and DSP acceleration
- Industrial automation, motor control, and instrumentation
- Communications interfaces and data-path bridging
- Data acquisition, sensing, test & measurement
- Prototyping, education, research, and hardware acceleration
- Low-to-mid‑resolution video/image processing

Envío

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DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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