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TLV2316IDGKR
- Fabricante
- Mfr. Parte #TLV2316IDGKR
- Paquete
- Hoja de datos
- En stock9844
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Especificaciones
| Package | Tape & Reel (TR),Cut Tape (CT) |
| ProductStatus | Active |
| AmplifierType | CMOS |
| NumberofCircuits | 2 |
| OutputType | Rail-to-Rail |
| SlewRate | 6V/µs |
| GainBandwidthProduct | 10 MHz |
| Current-InputBias | 10 pA |
| Voltage-InputOffset | 750 µV |
| Current-Supply | 400µA (x2 Channels) |
| Current-Output/Channel | 50 mA |
| Voltage-SupplySpan(Min) | 1.8 V |
| Voltage-SupplySpan(Max) | 5.5 V |
| OperatingTemperature | -40°C ~ 125°C |
| MountingType | Surface Mount |
| Package/Case | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) |
Descripción general
Description
The TLV2316IDGKR is characterized by its low quiescent current, making it ideal for energy-sensitive applications. It offers a good balance between speed and current consumption, with a gain bandwidth product that supports a range of general-purpose applications. The amplifier is housed in a small, surface-mount package, facilitating easy integration into compact circuit designs. Its stability, low noise, and efficient performance make it suitable for various applications, including sensor signal conditioning, portable devices, and medical instrumentation.
Features
The TLV2316IDGKR offers rail-to-rail input and output swing capabilities, maximizing dynamic range. Its wide bandwidth and fast slew rate enable efficient performance in high-speed applications. The device is typically used in applications such as sensor signal conditioning, active filters, and buffer amplifiers.
Additionally, it is packaged in a small, convenient VSSOP (DGK) package, making it suitable for space-constrained designs. The operational temperature range extends from -40°C to 125°C, allowing it to function effectively in harsh environments. The combination of these features makes the TLV2316IDGKR a versatile and efficient choice for a variety of general-purpose amplification needs.
Package
Pinout
1. Pin 1 (OUT1): Output of the first operational amplifier.
2. Pin 2 (IN–1): Inverting input of the first operational amplifier.
3. Pin 3 (IN+1): Non-inverting input of the first operational amplifier.
4. Pin 4 (V–): Negative power supply (ground in a single-supply configuration).
5. Pin 5 (IN+2): Non-inverting input of the second operational amplifier.
6. Pin 6 (IN–2): Inverting input of the second operational amplifier.
7. Pin 7 (OUT2): Output of the second operational amplifier.
8. Pin 8 (V+): Positive power supply.
The TLV2316 is used for various applications requiring low-voltage, low-power operation, and features rail-to-rail input and output with a wide bandwidth suitable for general-purpose amplification tasks.
Manufacturer
Application
Equivalent
1. TI TLV2333 – A dual-channel low-power op-amp.
2. Microchip MCP6022 – A low-power, dual op-amp with similar characteristics.
3. Analog Devices AD8606 – A precision, low-power, dual op-amp.
4. STMicroelectronics TS922 – A dual low-power op-amp.
Always compare specific parameters such as voltage range, bandwidth, and packaging to ensure compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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