THGBMJG8C4LBAU8

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THGBMJG8C4LBAU8

IC FLASH 256GBIT EMMC 153FBGA

  • Fabricante
  • Mfr. Parte #THGBMJG8C4LBAU8
  • Paquete FBGA-153
  • Hoja de datos
  • En stock5594

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Especificaciones

Package Tray
Series e•MMC™
ProductStatus Active
MemoryType Non-Volatile
MemoryFormat FLASH
Technology FLASH - NAND
MemorySize 256Gb (32G x 8)
MemoryInterface eMMC
OperatingTemperature -40°C ~ 105°C (TA)
MountingType Surface Mount
Package/Case 153-WFBGA

Descripción general

Description

It seems that "THGBMJG8C4LBAU8" refers to a specific code, possibly related to an electronic component, product, or system. However, without additional context, it’s challenging to provide an accurate introduction.
If it pertains to a memory chip, for instance, it may denote a particular model or serial number from a manufacturer, often used in electronics for identification and specification purposes. Such codes typically include information about the technology, capacity, speed, and other characteristics of the item.
For a comprehensive understanding, more details about the context in which THGBMJG8C4LBAU8 is used would be needed, such as its application, manufacturer, or related specifications. Please provide additional information for a more tailored response.

Features

The THGBMJG8C4LBAU8 is a NAND flash memory chip produced by Toshiba. It typically features:
1. Type: Multi-Level Cell (MLC) NAND flash technology.
2. Capacity: 8 Gb (Gigabits), equivalent to 1 GB (Gigabyte).
3. Interface: It usually uses a Serial Peripheral Interface (SPI) for communication, facilitating easy integration into various devices.
4. Endurance: Designed for high endurance, making it suitable for applications that require frequent read/write cycles.
5. Applications: Commonly used in consumer electronics, embedded systems, smartphones, tablets, and other devices requiring reliable storage solutions.
6. Performance: Offers a balance between speed and power efficiency, suitable for low-power applications.
This chip is particularly valued for its compact size and reliability in data storage solutions.

Package

The THGBMJG8C4LBAU8 is a NAND flash memory chip from Toshiba, typically packaged in a BGA (Ball Grid Array) format. This type of packaging allows for efficient thermal dissipation and a compact footprint, making it suitable for various applications in consumer electronics and computing devices.

Pinout

The THGBMJG8C4LBAU8 is a NAND flash memory chip manufactured by Toshiba. It features a total of 48 pins. The key functions of these pins include:
1. Power Supply Pins (VCC, VSS): Provide power to the chip.
2. Data Pins (D0-D7): Used for data input and output during read and write operations.
3. Command Pins (CE, WE, RE): Control chip enable, write enable, and read enable functions.
4. Address Pins (A0-A19): Used to address memory locations.
5. Status Pins (R/B): Indicate the status of the device (ready/busy).
6. Miscellaneous Pins: May include pins for additional functionalities, such as reset or protection.
This device is typically employed in consumer electronics, mobile devices, and embedded systems for data storage.

Manufacturer

The manufacturer of the THGBMJG8C4LBAU8 is Toshiba Memory Corporation, which is now part of Kioxia Holdings Corporation. Kioxia is a multinational company specializing in NAND flash memory and storage solutions. It was established as a standalone entity in 2017 after Toshiba's memory business was spun off. Kioxia focuses on producing innovative memory products for various applications, including consumer electronics, mobile devices, and enterprise storage solutions. The company's expertise in NAND technology positions it as a key player in the global semiconductor industry.

Application

THGBMJG8C4LBAU8 is a NAND flash memory chip primarily used in consumer electronics such as smartphones, tablets, and laptops. Its applications include data storage for applications, media files, and system operations, enabling fast read/write speeds and reliable performance. Additionally, it can be used in embedded systems, automotive applications, and industrial devices requiring compact and efficient storage solutions.

Equivalent

The THGBMJG8C4LBAU8 is a NAND flash memory chip. Equivalent products include:
1. Micron MT29F128G08CBABA
2. Samsung K9GAG08U0M
3. SK Hynix H26M31003GTR
4. SanDisk SDTNCG8G
5. Toshiba THGBMFG8C4LBAA
Always verify compatibility based on specific application requirements and datasheets.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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