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THGBMHG7C2LBAIL
IC FLASH 128GBIT EMMC 153WFBGA
- Fabricante
- Mfr. Parte #THGBMHG7C2LBAIL
- Paquete
- Hoja de datos
- En stock6106
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Memory Format | FLASH |
| Memory Size | 128Gbit |
| Memory Organization | 16G x 8 |
| Memory Interface | eMMC |
| Mounting Type | Surface Mount |
| Supplier Device Package | 153-WFBGA (11.5x13) |
| Base Product Number | THGBMHG |
Descripción general
Description
This particular model, THGBMHG7C2LBAIL, is known for its reliability and speed, making it suitable for high-performance applications. It offers a balance of storage capacity and efficiency, catering to the growing needs of modern technology for faster and more reliable data access. With advancements in NAND technology, devices like the THGBMHG7C2LBAIL continue to support the ever-increasing demand for storage in consumer electronics, industrial applications, and beyond.
Features
Key features include:
1. Capacity: It offers a storage capacity typically ranging from 32GB to 512GB.
2. 3D NAND Structure: Utilizes a vertically stacked cell structure to enhance storage density and scalability.
3. Performance: Improved read/write speeds compared to 2D NAND, ensuring faster data access and transfer rates.
4. Power Efficiency: Designed to consume less power, which is beneficial for battery-operated devices.
5. Reliability: Provides enhanced endurance and reliability due to its advanced error correction and wear-leveling technology.
6. Compact Design: Comes in a small package suitable for integration into slim and compact devices.
These features make the THGBMHG7C2LBAIL a versatile and efficient choice for enhancing storage performance across various tech devices.
Package
Pinout
The THGBMHG7C2LBAIL typically has a 153-ball BGA pin count, which allows for numerous connections to a printed circuit board (PCB). Each of these balls (or pins) serves a specific function such as power supply connections, data input/output, command, and control signals necessary for the operation of the NAND flash memory.
Given its BGA packaging, the module provides a high-density storage solution with fast data transfer rates, making it suitable for smartphones, tablets, and other portable devices. The chip's function is to store data non-volatilely, meaning it retains information even without power, making it essential for applications that require persistent data storage.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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