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THGBMFG7C2LBAIL
- Fabricante
- Mfr. Parte #THGBMFG7C2LBAIL
- Paquete
- Hoja de datos
- En stock4049
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Especificaciones
| Manufacturer | JLCPCB Assembly |
| Package | BGA |
Descripción general
Description
As part of Kioxia's BiCS FLASH™ lineup, the THGBMFG7C2LBAIL incorporates advanced 3D flash memory technology, which stacks memory cells vertically to increase storage density without increasing the physical footprint. This results in higher performance, improved power efficiency, and enhanced reliability compared to traditional 2D NAND flash memory solutions.
The product's specifications, such as storage capacity, performance characteristics, and power requirements, are designed to meet the demands of modern electronic devices, contributing to faster data processing and energy-efficient operation.
Features
1. Type: It is a NAND flash memory, known for non-volatile storage, meaning it retains data without power.
2. Capacity: The specific capacity isn't detailed in the part number, but chips in this series typically range from several gigabytes to terabytes.
3. Technology: Likely based on Toshiba's advanced 3D NAND technology, offering high density and reliability.
4. Applications: Commonly used in smartphones, tablets, SSDs, and other consumer electronics due to its compact size and efficient storage capabilities.
5. Interface: Uses a standard interface that facilitates easy integration into devices and systems.
6. Performance: Designed to offer fast read/write speeds, crucial for quick data access and storage efficiency in consumer devices.
7. Durability: Built to withstand numerous write/erase cycles, enhancing the lifespan of the memory in intensive applications.
For detailed specifications, consulting the manufacturer's datasheet or product documentation is recommended.
Package
Pinout
The THGBMFG7C2LBAIL typically comes in a BGA (Ball Grid Array) package, which might have a pin count of 153. However, exact pin count and functions might vary depending on the specific configuration and version.
In general, eMMC devices like the THGBMFG7C2LBAIL include pins for power supply, ground, data transfer, command, clock, and reset functions. Key signals often include:
- VCC and VCCQ: Power supply for the core and I/O respectively.
- GND: Ground.
- CMD: Command line for sending instructions.
- CLK: Clock signal for data synchronization.
- DAT0-DAT7: Data bus lines for input/output operations.
- RST_n: Reset signal.
For precise pin count and functions, refer to the specific datasheet or technical documentation for the THGBMFG7C2LBAIL.
Manufacturer
Application
Equivalent
1. Samsung's V-NAND series
2. Micron's 3D NAND lineup
3. Western Digital/SanDisk's BiCS series
4. SK Hynix's 3D NAND offerings
Each offers similar storage capacities and performance metrics, suitable for applications like SSDs, smartphones, and other data storage devices. Ensure compatibility by checking the specific technical specifications.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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