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TH58NYG3S0HBAI4
IC FLASH 8GBIT PARALLEL 63TFBGA
- Fabricante
- Mfr. Parte #TH58NYG3S0HBAI4
- Paquete TFBGA-63
- Hoja de datos
- En stock4581
100% original & Nuevo
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Garantía de 365 días
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Especificaciones
| Package | Tray |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (SLC) |
| MemorySize | 8Gb (1G x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| AccessTime | 25 ns |
| Voltage-Supply | 1.7V ~ 1.95V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Descripción general
Description
This NAND flash memory is commonly used in applications such as smartphones, tablets, SSDs, and other consumer electronics due to its reliability and speed. The characteristics of this specific model may include its memory architecture, storage capacity, read/write speeds, and endurance levels, which are crucial for ensuring efficient data management in modern technology.
For detailed specifications, including capacity and performance metrics, referring to the product datasheet provided by Toshiba or authorized distributors is recommended.
Features
1. Type: NAND Flash, specifically SLC (Single-Level Cell) or MLC (Multi-Level Cell) variants, depending on the application.
2. Capacity: Typically available in various densities, supporting a range of applications.
3. Interface: Utilizes a parallel or serial interface, facilitating ease of integration into various devices.
4. Endurance: Designed for high cycle endurance, suitable for enterprise and industrial applications.
5. Data Retention: Offers reliable data retention, ensuring data integrity over time.
6. Power Consumption: Optimized for low power consumption, making it suitable for battery-operated devices.
7. Temperature Range: Capable of operating in a wide temperature range, enhancing its usability in harsh environments.
This chip is commonly used in consumer electronics, automotive, and industrial applications due to its reliability and performance characteristics.
Package
Pinout
The primary function of the TH58NYG3S0HBAI4 is to provide non-volatile storage, making it suitable for various applications such as smartphones, tablets, SSDs, and other consumer electronics. It operates using standard NAND Flash memory protocols, allowing for data storage, retrieval, and management. This chip supports features like multiple plane operations and enhanced error correction capabilities, contributing to improved performance and reliability in data storage applications.
Manufacturer
Application
Equivalent
1. Samsung K9F4G08U0A
2. Micron MT29F4G08ABAEAWP
3. SK Hynix H26M21001G2
4. Toshiba TH58NYG3S0HBAA
Verifying compatibility with specific applications is essential before substituting any components.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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