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TC58BVG1S3HTAI0
IC FLASH 2GBIT PARALLEL 48TSOP I
- Fabricante
- Mfr. Parte #TC58BVG1S3HTAI0
- Paquete 48-TFSOP
- Hoja de datos
- En stock3538
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Especificaciones
| Package | Tray |
| Series | Benand™ |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND (SLC) |
| MemorySize | 2Gb (256M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| AccessTime | 25 ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 48-TFSOP (0.724, 18.40mm Width) |
Descripción general
Description
Key specifications include a large storage capacity, low power consumption, and robust error correction capabilities. The TC58BVG1S3HTAI0 supports various interfaces, making it versatile for different applications. Its design is optimized for high-speed data transfer and efficient storage management, which are critical for modern computing demands. Overall, the TC58BVG1S3HTAI0 represents a significant advancement in NAND technology, enabling the development of faster and more efficient storage solutions.
Features
1. Type: 3D Flash Memory (BiCS FLASH) technology, which stacks memory cells vertically for higher density and efficiency.
2. Capacity: Typically offers a storage capacity of 128GB to 512GB, depending on the specific variant.
3. Interface: Supports a Serial Peripheral Interface (SPI) for high-speed data transfer.
4. Endurance: Designed for high endurance with a significant number of program/erase cycles.
5. Performance: Enhanced read/write speeds suitable for consumer electronics, mobile devices, and industrial applications.
6. Power Efficiency: Low power consumption, making it ideal for battery-operated devices.
7. Form Factor: Available in compact packages suitable for various applications, including smartphones and tablets.
8. Reliability: Built-in error correction and data integrity features to ensure reliable operation over time.
Overall, the TC58BVG1S3HTAI0 offers a balance of performance, capacity, and reliability for modern storage solutions.
Package
Pinout
Key functions include:
- Power supply pins (VCC, VCCQ): Provide operating voltage.
- Ground pins (GND): Common reference point for the power supply.
- Data input/output pins (DQ0-DQ7): Used for data transfer to and from the memory.
- Control pins (WE, RE, CE): Control write, read, and chip enable operations.
- Command pins (CMD): Used for sending commands to the memory.
This chip is designed for high-performance applications in mobile devices, SSDs, and other storage solutions, supporting features like fast read/write speeds and low power consumption.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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