SCB13H8G162BF-13KI

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SCB13H8G162BF-13KI

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  • Mfr. Parte #SCB13H8G162BF-13KI
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Especificaciones

Manufacturer Unilc
Package FBGA-96

Descripción general

Description

The SCB13H8G162BF-13KI is a type of memory chip, specifically a synchronous dynamic random-access memory (SDRAM) module. It is designed for high-performance computing applications, offering fast data access speeds and enhanced reliability. The designation "13" typically indicates the memory density, while "H8G" signifies the specific architecture and organization of the memory cells.
This chip is often used in various devices, including computers, servers, and embedded systems, providing essential memory functions for processing and data storage. The inclusion of "BF" usually denotes specific features such as temperature range or packaging type, while "13KI" may refer to the manufacturer's code or production batch.
Overall, the SCB13H8G162BF-13KI is engineered for efficient performance in demanding environments, making it suitable for modern electronics that require fast and reliable memory solutions.

Features

The SCB13H8G162BF-13KI is a high-performance, low-power mobile DRAM memory chip. Key features include:
1. Capacity: 1 GB (8 Gbit density).
2. Interface: Supports a high-speed DDR3 interface for fast data transfer.
3. Voltage: Operates at a low voltage of 1.35V, which enhances energy efficiency.
4. Speed: Offers data rates up to 1600 MT/s, enabling efficient performance for mobile applications.
5. Package Type: Available in a compact BGA (Ball Grid Array) package, facilitating space-saving designs.
6. ECC Support: Includes Error-Correcting Code (ECC) capabilities for improved reliability.
7. Applications: Designed for mobile devices, tablets, and laptops, providing a balance of speed and efficiency.
These features make the SCB13H8G162BF-13KI ideal for modern mobile computing needs, optimizing both performance and power consumption.

Package

The SCB13H8G162BF-13KI is typically packaged in a TFBGA (Thin Fine Ball Grid Array) format. This package type is known for its compact size, allowing for high-density mounting in electronic devices, making it suitable for applications requiring efficient space utilization and thermal performance.

Pinout

The SCB13H8G162BF-13KI is a type of SRAM (Static Random Access Memory) device. It typically features a pin count of 48 pins.
The primary functions of this SRAM include:
1. Data Storage: It provides fast, volatile storage for data that is actively being used by the system.
2. Read/Write Operations: It supports high-speed read and write operations, essential for applications requiring quick access to data.
3. Addressing: The device utilizes address pins to select specific memory locations for data retrieval or storage.
4. Control Signals: It includes control pins for chip select, output enable, and write enable operations to manage data flow effectively.
These features make it suitable for high-performance applications in computing and embedded systems.

Manufacturer

The SCB13H8G162BF-13KI is manufactured by Cypress Semiconductor, a subsidiary of Infineon Technologies. Cypress is a technology company that specializes in the design and manufacture of advanced semiconductor solutions, including microcontrollers, memory products, and programmable systems. Established in 1982, the company is known for its expertise in embedded systems, particularly in areas like automotive, industrial, and consumer electronics. Cypress Semiconductor has a strong focus on innovation and provides a range of semiconductor products that cater to diverse applications, making it a key player in the semiconductor industry.

Application

The SCB13H8G162BF-13KI is a high-speed, low-power CMOS SRAM memory chip commonly used in applications such as embedded systems, networking equipment, telecommunications, automotive electronics, and industrial automation. Its features make it ideal for cache memory, data buffering, and real-time processing tasks where fast access and reliability are critical.

Equivalent

The SCB13H8G162BF-13KI chip is a memory device, specifically a 1Gb DDR3 SDRAM. Equivalent products may include other 1Gb DDR3 SDRAM chips from manufacturers such as Micron, Samsung, Hynix, and Nanya, as long as they meet similar specifications (e.g., speed, voltage, and package type). Check specific part numbers like MT41J128M16HA-15E, K4B4G1646C, or H5TQ2G63AFR. Always verify compatibility based on your application's requirements.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

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2. Tarjeta de crédito/débito

3. Transferencia bancaria

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