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S34ML04G100BHI000
IC FLASH 4GBIT PARALLEL 63BGA
- Fabricante
- Mfr. Parte #S34ML04G100BHI000
- Paquete BGA-63
- Hoja de datos S34ML04G100BHI000 DataSheet
- En stock5947
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Especificaciones
| Package | Bulk |
| Series | ML-1 |
| ProductStatus | Active |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 4Gb (512M x 8) |
| MemoryInterface | Parallel |
| WriteCycleTime-WordPage | 25ns |
| Voltage-Supply | 2.7V ~ 3.6V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Descripción general
Description
The chip operates with a supply voltage of 1.8V, making it suitable for low-power applications. It supports various interfaces, including ONFI (Open NAND Flash Interface) and a high-speed serial interface, allowing it to be integrated into a wide range of electronic devices such as smartphones, tablets, and industrial applications.
Key features include fast read and write speeds, robust data retention, and endurance, making it ideal for applications requiring reliable storage solutions. The S34ML04G100BHI000 is often selected for its scalability and compatibility with existing designs, making it a versatile choice for manufacturers looking to incorporate NAND flash memory into their products.
Features
1. Interface: It supports a parallel interface, suitable for various applications in consumer electronics and industrial systems.
2. Power Supply: Operates with a voltage range of 2.7V to 3.6V, ensuring compatibility with most low-power applications.
3. Speed: Offers fast read and write speeds, making it ideal for applications requiring quick data access.
4. Endurance: High endurance with a significant number of program/erase cycles, which enhances the longevity of the memory.
5. Temperature Range: Designed to operate across a wide temperature range, suitable for both commercial and industrial environments.
6. Package: Available in a compact BGA (Ball Grid Array) package, facilitating efficient space utilization on PCBs.
This device is suitable for applications in mobile devices, automotive systems, and other embedded systems needing reliable storage solutions.
Package
Pinout
The primary functions of these pins include:
- Power Supply: VCC and VSS pins provide power to the chip.
- Data I/O: Multiple pins (D0-D7) are for data input/output, facilitating data transfer.
- Control Signals: Pins such as RE#, WE#, and CE# are used for read, write, and chip enable operations, respectively.
- Addressing: Address pins (A0-A20) are used to select memory locations.
- Status Outputs: Some pins may serve as status indicators for operations, such as busy or ready signals.
The S34ML04G100BHI000 is designed for high-density storage applications, offering reliability and performance suitable for various embedded systems.
Manufacturer
Application
Equivalent
1. Micron MT29F4G01ABAEAWP
2. Samsung K9GAG08U0M
3. Hynix H26M31001G5
4. Toshiba TC58NVG4D2HBAI4
It's important to verify compatibility in terms of specifications like voltage, interface, and density before substitution.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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