OMAPL137DZKBA3

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OMAPL137DZKBA3

IC MPU OMAP-L1X 375MHZ 256BGA

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Especificaciones

Package Tray
Series OMAP-L1x
ProductStatus Active
CoreProcessor ARM926EJ-S
NumberofCores/BusWidth 1 Core, 32-Bit
Speed 375MHz
Co-Processors/DSP Signal Processing; C674x, System Control; CP15
RAMControllers SDRAM
GraphicsAcceleration No
Display&InterfaceControllers LCD
Ethernet 10/100Mbps (1)
USB USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage-I/O 1.8V, 3.3V
OperatingTemperature -40°C ~ 105°C (TJ)
Package/Case 256-BGA

Descripción general

Description

The OMAPL137DZKBA3 is a digital signal processor (DSP) and microcontroller unit (MCU) from Texas Instruments, part of the OMAP (Open Multimedia Applications Platform) family. It is designed for applications requiring high-performance processing capabilities, particularly in multimedia and communications.
Key features include a dual-core architecture consisting of an ARM926EJ-S core for general-purpose processing and a TMS320C674x DSP core for real-time signal processing. This combination allows for efficient handling of complex algorithms and multitasking.
The device supports various interfaces, including Ethernet, USB, and SPI, enabling connectivity for diverse applications. It operates at a moderate power level, making it suitable for embedded systems in industrial, automotive, and consumer electronics.
The OMAPL137DZKBA3 is particularly well-suited for tasks like audio processing, video compression, and industrial automation, where both processing power and efficiency are critical. Additionally, it is supported by a wide range of development tools and software, facilitating easier integration into projects.

Features

The OMAPL137DZKBA3 is a high-performance SoC (System on Chip) from Texas Instruments, designed primarily for industrial applications. Key features include:
1. Dual-core Architecture: It integrates an ARM Cortex-A8 core and a C674x DSP core, providing a balance of high-performance processing and efficient signal processing capabilities.

2. High Speed Processing: Supports up to 1GHz operation for the ARM core, enabling robust application execution.
3. Memory Interface: Features DDR2/DDR3 memory interface support, allowing for efficient data handling.
4. Rich Peripherals: Includes GPIOs, UART, SPI, I2C, and McBSP interfaces, facilitating diverse connectivity options.
5. Video Processing: Equipped with video encoding/decoding capabilities to support multimedia applications.
6. Low Power Consumption: Designed for energy efficiency, making it suitable for battery-powered devices.
7. Development Support: Compatible with TI's development tools and software, simplifying application development.
These features make the OMAPL137DZKBA3 suitable for applications in automation, medical devices, and imaging systems.

Package

The OMAPL137DZKBA3 is packaged in a 15mm x 15mm BGA (Ball Grid Array) format with a 0.8mm ball pitch. This package type is designed for enhanced thermal performance and efficient space utilization on PCBs.

Pinout

The OMAPL137DZKBA3 is a Texas Instruments processor with a pin count of 289. It is part of the OMAP-L137 family, which combines an ARM9 processor with a DSP (Digital Signal Processor) for efficient processing in embedded applications.
In terms of function, the OMAPL137 is designed for applications that require a balance of performance and power efficiency, particularly in areas such as industrial automation, medical instrumentation, and communications. It supports various interfaces, including USB, Ethernet, and multiple serial communication protocols, enabling connectivity and integration in diverse systems. The device also includes integrated memory controllers and supports various memory types, enhancing its versatility in application development.
For detailed specifications and pin configurations, refer to the official Texas Instruments documentation.

Manufacturer

The OMAPL137DZKBA3 is manufactured by Texas Instruments (TI), a leading American technology company. Texas Instruments is renowned for its semiconductor design and manufacturing, particularly in analog and embedded processing. The company produces a wide range of products, including microcontrollers, processors, and other integrated circuits used across various industries such as automotive, industrial, telecommunications, and consumer electronics. Established in 1930, TI has a strong focus on innovation and research, contributing significantly to advancements in electronic solutions and technologies.

Application

The OMAPL137DZKBA3 is a low-power, embedded processor primarily used in industrial control systems, medical imaging, and automotive applications. Its dual-core architecture enables real-time processing for robotics, machine vision, and communications. Additionally, it supports multimedia processing for applications such as digital signage and video surveillance.

Equivalent

The OMAPL137DZKBA3 chip is part of the Texas Instruments OMAP-L137 family. Equivalent products include the OMAPL138, which offers similar processing capabilities with additional features, and the OMAPL137ZDKBA3 variant, which may differ in peripheral support or package type. Additionally, other TI chips like the Sitara AM335x series might serve similar applications, depending on performance and interface needs. Always verify specifications for compatibility.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

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