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NT6TL128T64BR-G0
- Fabricante
- Mfr. Parte #NT6TL128T64BR-G0
- Paquete
- Hoja de datos
- En stock12848
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Especificaciones
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.36 |
| Automotive | Unknown |
| PPAP | Unknown |
| Mounting | Surface Mount |
| Package Height | 0.59(Max) |
| Package Width | 12 |
| Package Length | 12 |
| PCB changed | 216 |
| Standard Package Name | BGA |
| Supplier Package | POP-FBGA |
| Pin Count | 216 |
| Lead Shape | Ball |
Descripción general
Description
This DDR3 SDRAM module operates at a voltage of 1.5V, allowing for lower power consumption compared to its predecessors. It supports a data rate of up to 1600 MT/s (megatransfers per second), enhancing data transfer speeds and overall system performance. The chip is packaged in a standard FBGA (Fine Pitch Ball Grid Array) format, facilitating easy integration into electronic circuits.
Additionally, the NT6TL128T64BR-G0 complies with industry standards, ensuring reliability and compatibility with a wide range of systems. Its features make it an essential component for users looking to enhance their computing experience through improved memory performance.
Features
1. Type: DDR3 SDRAM
2. Capacity: 1 Gigabit (128 Megabytes x 64)
3. Configuration: 128M x 64 bits organization
4. Speed: Operates at a data rate of 1066 MT/s (megatransfers per second)
5. Voltage: 1.5V operating voltage
6. Package: Typically available in a FBGA (Fine Ball Grid Array) package
7. Latency: Offers low latency for improved performance in various applications.
8. Applications: Suitable for use in servers, networking equipment, and other memory-intensive applications.
This module provides improved bandwidth and energy efficiency compared to earlier DDR2 modules, making it a popular choice for modern electronic systems.
Package
Pinout
The primary functions of the pins include data input/output, address, command, control signals, and power connections. Key pin functions include:
- Data Pins (DQ0-DQ63): Used for data transfer.
- Address Pins (A0-A12, BA0-BA2): Used for addressing memory locations.
- Control Pins (CK, CK#, CS#, RAS#, CAS#, WE#): Used for controlling the memory operations.
- Power and Ground Pins (VDD, VSS): Provide power supply and ground connection.
This configuration is suitable for high-performance applications in computers and other electronic devices.
Manufacturer
Application
Equivalent
1. MT6HT12864HY-667
2. Hynix HYMD516646B6D
3. KVR667D2N5/1G (Kingston)
4. M471B5673FH0-CH9 (Samsung)
Always verify compatibility based on specific requirements like timings, voltage, and density before substitution.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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