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NT6AN256M16AV-J2
- Fabricante
- Mfr. Parte #NT6AN256M16AV-J2
- Paquete
- Hoja de datos NT6AN256M16AV-J2 DataSheet
- En stock7935
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Especificaciones
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | EA |
| Automotive | Unknown |
| PPAP | Unknown |
| Chip Density (bit) | 4G |
| Number of Bits/Word (bit) | 16 |
| Interface Type | LVSTL |
| Minimum Operating Supply Voltage (V) | 1.06|1.7 |
| Maximum Operating Supply Voltage (V) | 1.17|1.95 |
| Operating Current (mA) | 280 |
| Minimum Operating Temperature (°C) | -30 |
| Maximum Operating Temperature (°C) | 105 |
| Mounting | Surface Mount |
| Package Height | 0.48(Max) |
| Package Width | 10 |
| Package Length | 15 |
| PCB changed | 200 |
| Standard Package Name | BGA |
| Supplier Package | FBGA |
| Pin Count | 200 |
| DRAM Type | Mobile LPDDR4 SDRAM |
| Organization | 256Mx16 |
| Number of Internal Banks | 8 |
| Number of Words per Bank | 32M |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 3733 |
| Maximum Access Time (ns) | 3.6 |
| Address Bus Width (bit) | 18 |
| Number of I/O Lines (bit) | 16 |
| Supplier Temperature Grade | Commercial |
Descripción general
Description
Key features include low power consumption, which makes it ideal for energy-efficient designs, and advanced error-correction capabilities, improving data integrity. The module is often used in conjunction with memory controllers to facilitate quick data access and efficient multitasking in modern computing environments.
Its packaging typically follows industry standards, enabling easy integration into various hardware platforms. Overall, the NT6AN256M16AV-J2 represents a reliable solution for enhancing memory capacity and speed in digital devices.
Features
1. Density: 256 Megabytes (MB) per chip with a configuration of 16 bits.
2. Speed: Operates at speeds up to 1066 MT/s (Million Transfers per second), ensuring efficient data transfer rates.
3. Voltage: Typically operates at a low voltage of 1.5V, contributing to reduced power consumption.
4. Package: Available in a small form factor, often in a TSOP (Thin Small Outline Package) for easier integration into devices.
5. Architecture: Supports a 4-bank architecture, enhancing performance through parallel access.
6. Compatibility: Designed to meet industry standards, making it compatible with a wide range of DDR3 applications.
7. Temperature Range: Suitable for industrial and commercial temperature ranges, allowing for versatile applications.
These features make the NT6AN256M16AV-J2 suitable for various computing tasks, including embedded systems, telecommunications, and consumer electronics.
Package
Pinout
Manufacturer
Application
Equivalent
1. MT47H256M16RT-25E
2. K4T1G164QE-HC3
3. Hynix HY5PS25621BFP-D43
4. Samsung K4T1G164QE-HCE7
These alternatives offer similar specifications, such as capacity, architecture, and speed. Always verify compatibility with your specific application.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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