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NT5DS32M16ES-5T
- Fabricante
- Mfr. Parte #NT5DS32M16ES-5T
- Paquete
- Hoja de datos
- En stock6370
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Obsolete |
| HTS | 8542.32.00.28 |
| Automotive | Unknown |
| PPAP | Unknown |
| Minimum Operating Supply Voltage (V) | 2.3 |
| Typical Operating Supply Voltage (V) | 2.5 |
| Maximum Operating Supply Voltage (V) | 2.7 |
| Minimum Operating Temperature (°C) | 0 |
| Maximum Operating Temperature (°C) | 70 |
| Supplier Temperature Grade | Commercial |
| Mounting | Surface Mount |
| Package Height | 1.2(Max) |
| Package Width | 10.16 |
| Package Length | 22.22 |
| PCB changed | 66 |
| Standard Package Name | SO |
| Supplier Package | TSOP-II |
| Pin Count | 66 |
| Chip Density (bit) | 512M |
| Number of Bits/Word (bit) | 16 |
| Data Bus Width (bit) | 16 |
| Maximum Clock Rate (MHz) | 400 |
| DRAM Type | DDR SDRAM |
| Organization | 32Mx16 |
| Number of Internal Banks | 4 |
| Number of Words per Bank | 8M |
| Address Bus Width (bit) | 15 |
| Operating Current (mA) | 120 |
| Number of I/O Lines (bit) | 16 |
| Maximum Access Time (ns) | 0.7 |
| Interface Type | SSTL_2 |
Descripción general
Description
Key specifications include a clock speed typically around 400 MHz, allowing for efficient data transfer rates, and a density of 32MB per chip. The package is usually in a TSOP (Thin Small Outline Package) format, facilitating easy integration onto PCBs (Printed Circuit Boards). DDR2 technology enhances performance over its predecessor, DDR, by enabling faster data access and lower power consumption.
Overall, the NT5DS32M16ES-5T is a reliable choice for enhancing memory performance in various electronic applications.
Features
1. Capacity: 2GB (Gigabytes) of memory.
2. Configuration: 256M x 16 bits configuration, allowing for efficient data handling.
3. Speed: Operates at a clock speed of 1600 MT/s (megatransfers per second), enabling high-speed data transfer.
4. Voltage: Typically operates at a 1.5V power supply, compatible with standard DDR3 applications.
5. Package Type: Available in a 78-ball FBGA (Fine Ball Grid Array) package for compact integration.
6. Latency: CL11 (CAS Latency of 11), suitable for various applications requiring moderate latency.
7. Compatibility: Designed for use in laptops, desktops, and other devices supporting DDR3 memory.
This memory chip is ideal for applications requiring reliable performance and efficiency in data-intensive environments.
Package
Pinout
Manufacturer
Application
Equivalent
1. MT41J256M16HA-125
2. H5TQ2G63AFR-PBA
3. K4B4G1646D-BCK0
Ensure compatibility with the specific application in terms of speed, voltage, and configuration before substituting.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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