Las imágenes son solo para referencia
NT5CC128M8GN-DI
- Fabricante
- Mfr. Parte #NT5CC128M8GN-DI
- Paquete
- Hoja de datos NT5CC128M8GN-DI DataSheet
- En stock29954
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
RFQ y Obtenga más descuentos
Especificaciones
| EU RoHS | Compliant |
| ECCN (US) | EAR99 |
| Part Status | Active |
| HTS | 8542.32.00.32 |
| Automotive | No |
| PPAP | No |
| Mounting | Surface Mount |
| Package Height | 0.8(Max) |
| Package Width | 8 |
| Package Length | 10.5 |
| PCB changed | 78 |
| Standard Package Name | BGA |
| Supplier Package | VFBGA |
| Pin Count | 78 |
Descripción general
Description
Key features include:
- Data Rate: Supports high-speed data transfers, typically up to 1600 MT/s (megatransfers per second).
- Memory Architecture: Organized in a x8 configuration, allowing for efficient data handling.
- Power Efficiency: Operates at a voltage of 1.5V, which is standard for DDR3 memory, providing a balance between performance and power consumption.
- Package Type: Typically available in a small footprint package, suitable for space-constrained applications.
The NT5CC128M8GN-DI is ideal for applications requiring reliable and fast memory solutions, contributing to improved performance in computing tasks.
Features
1. Capacity: 1 GB density, suitable for use in mobile devices, laptops, and embedded systems.
2. Bus Width: 8 bits, allowing for efficient data transfer.
3. Speed: Operates at standard DDR3 speeds, typically ranging from 800 to 1600 MT/s.
4. Voltage: Operates at 1.5V, which helps in reducing power consumption compared to older DDR generations.
5. Organization: Configured as 128M x 8, which enables high-density memory integration.
6. Package: Available in a small form factor, typically in a FBGA (Fine Ball Grid Array) package, which is suitable for space-constrained applications.
7. Compatibility: Designed to be compatible with various DDR3 controllers and systems.
These features make the NT5CC128M8GN-DI ideal for enhancing performance and efficiency in consumer electronics and computing devices.
Package
Pinout
Manufacturer
Application
Equivalent
1. Micron MT41K128M16HA-125
2. Hynix H5TQ2G83AFR
3. Samsung K4B4G1646D
4. Nanya NT5CC256M8DN-DI
Ensure to check parameters like speed, voltage, and form factor for compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
Similar
-
MX25V4035FZUI
Macronix
-
MX25V2033FM1I
Macronix
-
MX25R3235FZNIL0
Macronix
-
MX25L8035EM2I-10G
Macronix
-
MX25R6435FBDIL0
Macronix
-
MX25L25673GMI-08G
Macronix
-
MX25L25673GMI-10G
Macronix
-
MX25R1635FZUIH0
Macronix
-
MX25U3232FZBI02
Macronix
-
MX25L12833FZNI-10..
Macronix
-
MX25U25645GXDI00
Macronix
-
MX29F800CBTI-70G
Macronix