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MX52LM04A11XSI
IC FLASH 4GB EMMC 153-BGA (11.5X
- Fabricante
- Mfr. Parte #MX52LM04A11XSI
- Paquete
- Hoja de datos MX52LM04A11XSI DataSheet
- En stock20780
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Especificaciones
| Series | e.MMC™ |
| Part Status | Active |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (MLC) |
| Memory Size | 32Gbit |
| Memory Organization | 4G x 8 |
| Memory Interface | eMMC_5.1 |
| Clock Frequency | 200 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 153-VFBGA |
| Supplier Device Package | 153-LFBGA (11.5x13) |
| Packaging | Tray |
Descripción general
Description
It's often used in embedded systems, including automotive electronics, IoT devices, and portable gadgets, where reliability and performance are crucial. The MX52LM04A11XSI is compatible with common communication protocols, ensuring easy integration into existing designs. Additionally, it is built to withstand a range of environmental conditions, enhancing its durability and longevity in various operating scenarios. Overall, this memory chip is a key component for developers looking for efficient and effective memory solutions in modern electronic applications.
Features
1. Memory Capacity: 4 Megabits (512KB).
2. Access Time: Fast access times typically around 55 ns.
3. Operating Voltage: Typically operates at 3.0V to 3.6V, enabling low power consumption.
4. Data Bus Width: 8 bits, allowing for byte-wide data access.
5. Low Power Consumption: Designed for battery-operated devices, it features low active and standby power modes.
6. Asynchronous Operation: No clock signal required for operation, simplifying design.
7. Temperature Range: Generally supports industrial temperature ranges, suitable for various environmental conditions.
8. Compatibility: Often used in embedded systems, telecommunications, and consumer electronics.
These features make the MX52LM04A11XSI ideal for applications requiring fast, efficient, and reliable memory solutions.
Package
Pinout
The main functions of the pins include:
- Address pins (A0 to A18): Used to select memory locations.
- Data pins (DQ0 to DQ7): Bidirectional data bus for reading and writing data.
- Control pins:
- Chip Enable (CE): Activates the chip for read/write operations.
- Write Enable (WE): Determines whether the operation is a read (inactive) or write (active).
- Output Enable (OE): Activates the output drivers for reading data.
- Ground (VSS): Common ground connection.
- Power Supply (VDD): Provides the necessary operating voltage.
This SRAM is designed for applications requiring fast data access with low latency.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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