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MX25U12832FZ4I02
IC FLASH 128MBIT SPI/QUAD 8WSON
- Fabricante
- Mfr. Parte #MX25U12832FZ4I02
- Paquete
- Hoja de datos
- En stock5426
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Especificaciones
| Series | MXSMIO™ |
| Part Status | Active |
| Base Product Number | MX25U12832 |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NOR |
| Memory Size | 128Mbit |
| Memory Organization | 16M x 8 |
| Memory Interface | SPI - Quad I/O, QPI |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 40µs, 3ms |
| Voltage - Supply | 1.65V ~ 2V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package | 8-WDFN Exposed Pad |
| Supplier Device Package | 8-WSON (8x6) |
| Packaging | Tray |
Descripción general
Description
1. Memory Density: 128Mb capacity, suitable for storing firmware, configuration data, and other applications.
2. Performance: With a read speed of up to 104 MHz, it supports fast data access, making it ideal for performance-sensitive applications.
3. Endurance and Reliability: The chip offers up to 100,000 program/erase cycles and data retention of up to 20 years, ensuring long-term reliability.
4. Power Efficiency: Consumes low power during operation, which is beneficial for battery-operated devices.
5. Package Options: Available in various packages, including WSON and SOP, for flexible design implementations.
Typical uses include consumer electronics, automotive systems, and industrial applications, where reliable non-volatile storage is essential.
Features
1. Interface: Supports standard SPI (Serial Peripheral Interface) and Quad SPI for high-speed data transfer.
2. Memory Density: 128Mb capacity, ideal for storing firmware, configuration data, and files.
3. Speed: Read speeds up to 104 MHz in Quad SPI mode; fast program and erase times.
4. Volatile and Non-Volatile: Retains data without power; ideal for embedded applications.
5. Erase Block Size: Features sector erase sizes of 4KB, 32KB, and 64KB, allowing for flexible data management.
6. Endurance: Supports a minimum of 100,000 program/erase cycles, ensuring durability.
7. Data Retention: Typically retains data for over 20 years at 85°C.
8. Low Power Consumption: Operates with low power requirements, suitable for battery-operated devices.
9. Form Factor: Available in various packages, including WSON and SOP, facilitating easy integration into designs.
This chip is suitable for a wide range of applications, including consumer electronics, automotive systems, and IoT devices.
Package
Pinout
1. GND: Ground connection.
2. VCC: Power supply (typically 2.7V to 3.6V).
3. SCK: Serial clock input.
4. DI: Data input (Serial data input).
5. DO: Data output (Serial data output).
6. CS#: Chip select (active low).
7. WP#: Write protect (active low, optional).
8. HOLD#: Hold (active low, optional).
This chip supports various operations, including read, program, and erase, through a Serial Peripheral Interface (SPI), making it suitable for a wide range of applications in embedded systems.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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