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MT53E256M32D2DS-046 IT:B
DRAM LPDDR4 8G 256MX32 FBGA DDP
- Fabricante
- Mfr. Parte #MT53E256M32D2DS-046 IT:B
- Paquete
- Hoja de datos MT53E256M32D2DS-046 IT:B DataSheet
- En stock3522
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Especificaciones
| Packaging | Tray |
| Standard Pack Qty | 1360 |
Descripción general
Description
Key features include a speed grade of 1,600 MT/s (megatransfers per second), which allows for higher bandwidth compared to previous generations, and it operates at a voltage of 1.2V, enhancing energy efficiency. The "IT:B" designation indicates specific temperature and environmental ratings suitable for industrial applications.
This component is widely used in various applications, including servers, networking equipment, and embedded systems, where reliable and fast memory is critical. Its advanced architecture supports features like error correction and enhanced reliability, making it suitable for mission-critical tasks.
Features
1. Density: 256 Megabits (32 Megabytes) per chip.
2. Data Width: 32 bits, suitable for various applications requiring wide data paths.
3. Operating Frequency: Designed for operational speeds up to 2400 MT/s (megatransfers per second).
4. Voltage: Operates at a low voltage of 1.2V, enhancing energy efficiency.
5. Form Factor: Typically in a compact BGA (Ball Grid Array) package, facilitating easy integration into devices.
6. Temperature Range: Industrial grade, supporting a wide temperature range for reliable performance in harsh environments.
7. Features: Includes advanced error correction capabilities (ECC), ensuring data integrity and reliability.
This memory chip is ideal for applications in embedded systems, networking, and industrial environments where performance and stability are critical.
Package
Pinout
The primary functions of the pins include data transfer, command and control signaling, as well as power and ground connections. Key pins include:
- DQs (Data Lines): 32 data pins for bidirectional data transfer.
- DQMs (Data Mask): Used to mask data during writes.
- CLK (Clock): For synchronizing data transfers.
- CS (Chip Select): Indicates when the chip is active.
- RAS, CAS, WE (Row Address Strobe, Column Address Strobe, Write Enable): Control signals for accessing memory rows and columns.
- VDD/VSS (Power/Ground): Supply voltage and ground connections.
This configuration supports high data rates and bandwidth suitable for modern computing environments.
Manufacturer
Application
Equivalent
1. Samsung K4AAG085WE-BCRC
2. Micron MT40A256M32JR-075
3. Hynix H5AN8G6NBJR-UHC
Always verify specifications and compatibility for specific applications before substitution.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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