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MT48LC16M16A2P-7E:G
IC DRAM 256MBIT PAR 54TSOP II
- Fabricante
- Mfr. Parte #MT48LC16M16A2P-7E:G
- Paquete
- Hoja de datos
- En stock5139
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Especificaciones
| Part Status | Obsolete |
| Base Product Number | MT48LC16M16A2 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM |
| Memory Size | 256Mbit |
| Memory Organization | 16M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 133 MHz |
| Write Cycle Time - Word, Page | 14ns |
| Voltage - Supply | 3V ~ 3.6V |
| Operating Temperature | 0°C ~ 70°C (TA) |
| Mounting Type | Surface Mount |
| Package | 54-TSOP (0.400", 10.16mm Width) |
| Supplier Device Package | 54-TSOP II |
| Packaging | Tray |
| Access Time | 5.4 ns |
Descripción general
Description
Key specifications include:
- Configuration: 16M x 16 bits
- Speed: Operates at a clock frequency of 143 MHz, with a data rate of 2.5 Gbps.
- Package: Typically available in a 54-ball Thin Ball Grid Array (TBGA).
- Voltage: Operates on a 2.5V power supply.
- Access times: Offers fast access times with low latency, making it suitable for a variety of applications, including mobile devices, networking, and consumer electronics.
This chip is designed for compatibility with standard DDR memory controllers and is ideal for systems requiring efficient data throughput and high reliability.
Features
1. Density: 256 Megabits (16 Megabytes) organized as 16M x 16 bits.
2. Speed: Operates at a clock frequency of 200 MHz (DDR-400), supporting data rates up to 800 MT/s.
3. Interface: 3.2V power supply and supports SSTL_2 signaling.
4. Package: Available in a 66-ball FBGA (Fine Ball Grid Array) package.
5. Burst Length: Supports burst lengths of 2, 4, or 8 for efficient data access.
6. Refresh: 8,192-cycle refresh with an automatic refresh feature.
7. Operating Temperature: Commercial temperature range from 0°C to 70°C.
8. Compatibility: Backward compatible with earlier DDR SDRAM standards.
This memory is primarily used in computing and telecommunications applications, providing high-speed data transfer rates suitable for various devices.
Package
Pinout
### Pin Functions:
- Data Pins (DQ0-DQ15): These pins are used for data input/output.
- Address Pins (A0-A13): These pins are used for addressing the memory locations.
- Control Pins: Includes `CS` (Chip Select), `RAS` (Row Address Strobe), `CAS` (Column Address Strobe), and `WE` (Write Enable), which control the read/write operations.
- Clock Pins (CLK, CLK#): Used for synchronizing the data transmission.
- Power Pins (VDD, VSS): Supply voltage and ground.
- Other Control Pins: Include `ODT` (On-Die Termination), `BA0-BA1` (Bank Address), and `CKE` (Clock Enable) for various operational controls.
This DRAM component is optimized for high-speed applications, supporting DDR operation at a frequency of up to 166 MHz.
Manufacturer
Application
Equivalent
1. K4S281632E (Samsung)
2. HY57V281620E (Hynix)
3. IS42S16100J (ISSI)
4. M5M5V128BTP (Mitsubishi)
Always verify compatibility regarding specifications and pin configurations before replacement.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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