MT48H32M16LFB4-6 IT:C

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MT48H32M16LFB4-6 IT:C

512Mbit 1.7V~1.95V 166MHz VFBGA-54(8x8) Memory (ICs) RoHS

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  • Mfr. Parte #MT48H32M16LFB4-6 IT:C
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  • En stock2225

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Especificaciones

Packaging VFBGA-54(8x8)
Clock Frequency 166MHz
Memory Size 512Mbit
Operating temperature -40℃~+85℃
Voltage - Supply 1.7V~1.95V

Descripción general

Description

The MT48H32M16LFB4-6 IT:C is a high-performance DDR3 SDRAM (Synchronous Dynamic Random Access Memory) module manufactured by Micron Technology. It features a 1Gb (gigabit) configuration organized in 32 banks of 16 bits each. The "LFB4" indicates it's a low-profile, 78-ball, Fine-Pitch Ball Grid Array (FBGA) package, suitable for compact applications.
With a speed grade of 6, it supports data transfer rates of up to 1600 MT/s (million transfers per second). The "IT" designation suggests it's rated for industrial temperature range, operating reliably from -40°C to +95°C. This makes it ideal for applications requiring durability in extreme environments, such as automotive, industrial control, and telecommunications.
The chip utilizes a 1.5V power supply, which helps in reducing power consumption compared to previous generations. Overall, the MT48H32M16LFB4-6 IT:C is designed for applications needing high-density, reliable memory solutions with robust performance characteristics.

Features

The MT48H32M16LFB4-6 IT:C is a DDR3 SDRAM memory chip manufactured by Micron Technology. Here are its key features:
1. Type: DDR3 SDRAM
2. Capacity: 512 MB (32 Meg x 16 bits)
3. Organization: 32 megabytes x 16 bits
4. Speed: Operates at a clock frequency of 400 MHz, with a data rate of 1066 MT/s.
5. Voltage: Operates at a low voltage of 1.5V.
6. Packaging: Available in a FBGA (Fine Ball Grid Array) package.
7. Temperature Range: Industrial temperature range (-40°C to +85°C).
8. Features: Supports burst read and write operations, with a prefetch buffer of 8 bits for improved performance.
9. Latency: Offers low latency suitable for a variety of applications.
10. Compatibility: Designed for use in various embedded systems and industrial applications.
This chip is suitable for applications requiring reliable memory solutions under harsh conditions.

Package

The MT48H32M16LFB4-6 IT:C is a DDR3 SDRAM memory chip packaged in a 78-ball FBGA (Fine Ball Grid Array) format. This package type allows for efficient thermal management and compact mounting on PCBs.

Pinout

The MT48H32M16LFB4-6 IT:C is a DDR3 SDRAM memory chip with a pin count of 78. It operates with a 1.5V power supply and features a 32M x 16 configuration, which allows it to store 512 megabits of data. Its key functions include data storage, interfacing with memory controllers, and supporting high-speed data transfer rates. This chip is designed for applications requiring efficient memory performance in devices such as computers, servers, and networking equipment. The "LFBGA" (Lead Free Ball Grid Array) package type indicates its physical form factor. The "-6" denotes the speed grade, which indicates the maximum data rate the chip can achieve.

Manufacturer

The manufacturer of the MT48H32M16LFB4-6 IT:C is Micron Technology, Inc. Micron is an American semiconductor company that specializes in memory and storage solutions, particularly DRAM, NAND flash memory, and other related technologies. Founded in 1978 and headquartered in Boise, Idaho, Micron serves a variety of markets, including computing, networking, automotive, and mobile devices. The company is known for its innovations in memory technology and plays a significant role in the global semiconductor industry.

Application

The MT48H32M16LFB4-6 IT:C is a DDR3 SDRAM memory chip commonly used in various applications including laptops, desktops, servers, and networking equipment. It is suited for high-performance computing tasks, embedded systems, and industrial applications requiring reliable memory solutions. Its features make it ideal for data-intensive applications, including multimedia processing and gaming.

Equivalent

The MT48H32M16LFB4-6 IT:C chip is a DDR3 SDRAM component. Equivalent products include:
1. Hynix H5TQ4G63AFFR - DDR3 SDRAM
2. Samsung K4B4G1646E - DDR3 SDRAM
3. Micron MT41K256M16HA-125 - DDR3 SDRAM
Always verify specifications such as speed, voltage, and package type for compatibility.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria

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