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MT41J64M16JT-125:G
IC DRAM 1GBIT PARALLEL 96FBGA
- Fabricante
- Mfr. Parte #MT41J64M16JT-125:G
- Paquete
- Hoja de datos MT41J64M16JT-125:G DataSheet
- En stock2723
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Especificaciones
| Part Status | Obsolete |
| Base Product Number | MT41J64M16 |
| DigiKey Programmable | Not Verified |
| Memory Type | Volatile |
| Memory Format | DRAM |
| Technology | SDRAM - DDR3 |
| Memory Size | 1Gbit |
| Memory Organization | 64M x 16 |
| Memory Interface | Parallel |
| Clock Frequency | 800 MHz |
| Voltage - Supply | 1.425V ~ 1.575V |
| Operating Temperature | 0°C ~ 95°C (TC) |
| Mounting Type | Surface Mount |
| Package | 96-TFBGA |
| Supplier Device Package | 96-FBGA (8x14) |
| Packaging | Tray |
Descripción general
Description
Features
1. Density and Organization: It has a 1 Gb density, organized as 64M x 16.
2. Speed: The component supports a data rate of 1600 MT/s (million transfers per second).
3. Latency: CAS latencies of 11, 10, 9, and 8 are supported.
4. Voltage: Operates at a voltage of 1.5V.
5. Package: Comes in a 96-ball FBGA (Fine-Pitch Ball Grid Array) package.
6. Temperature Ranges: Standard operating temperature range is 0°C to 95°C.
7. Bank Architecture: Features 8 internal banks for efficient data handling.
8. Burst Lengths: Supports burst lengths of 8 and 4 (via the burst chop feature).
9. Auto-Refresh: Incorporates auto and self-refresh modes for power savings.
10. Compatibility: Compliant with JEDEC standards for seamless integration.
These features make the MT41J64M16JT-125:G suitable for a variety of computing and communication applications that require efficient and high-speed data processing.
Package
Pinout
Key functions and features include:
- Storage Capacity: 1 Gigabit (Gb).
- Configuration: 64 Meg x 16 bits.
- Voltage: Operates at a standard 1.5V power supply.
- Speed: Supports data rates up to DDR3-1600, with a clock cycle time (tCK) of 1.25ns for the -125 speed grade.
- Features: Includes on-die termination (ODT), dynamic on-die termination, programmable CAS latency, burst length, and self-refresh mode.
This memory chip is used in a wide variety of computing and electronic applications to provide high-speed data storage and retrieval capabilities. The 96-ball FBGA package allows for efficient PCB routing and compact design integration within systems.
Manufacturer
Application
Equivalent
1. Hynix H5TQ4G63AFR: Similar DDR3 SDRAM specifications.
2. Samsung K4B4G1646D: Matches DDR3 specifications.
3. SK Hynix H5TQ2G83BFR: DDR3 SDRAM with comparable features.
4. Nanya NT5CB64M16: Similar DDR3 configuration.
These equivalents have similar memory capacities, speed, and DDR3 technology, making them suitable alternatives.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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