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MT29F2G16ABBEAHC-AIT:E TR
NAND Flash SLC 2G 128MX16 FBGA
- Fabricante
- Mfr. Parte #MT29F2G16ABBEAHC-AIT:E TR
- Paquete
- Hoja de datos MT29F2G16ABBEAHC-AIT:E TR DataSheet
- En stock6727
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Packaging | MouseReel |
| Standard Pack Qty | 1000 |
Descripción general
Description
Operating with a serial interface, this NAND flash supports asynchronous and synchronous modes, providing flexibility in data transfer rates. The chip is built using advanced 3D NAND technology, which improves reliability and endurance compared to traditional planar NAND. It supports features such as wear leveling and bad block management, which are essential for maintaining data integrity over time.
The “-AIT” designator indicates specific temperature and performance characteristics, while “TR” denotes that the product is supplied in tape and reel packaging for automated assembly processes. Overall, this NAND flash memory chip is suitable for applications requiring high-density storage with efficient performance.
Features
1. Density: 2 Gb (Gigabits) capacity.
2. Interface: Supports ONFI (Open NAND Flash Interface) for interoperability with various host controllers.
3. Form Factor: Typically available in a small BGA (Ball Grid Array) package for compact designs.
4. Speed: Offers high read and write speeds, suitable for fast data access and storage.
5. Endurance: Designed for multiple program/erase cycles, enhancing longevity for demanding applications.
6. Power Management: Low power consumption modes to extend battery life in portable devices.
7. Reliability: Incorporates error correction features for data integrity and reliability.
8. Operating Temperature: Supports a wide temperature range, making it suitable for industrial applications.
This chip is ideal for use in consumer electronics, automotive systems, and industrial applications requiring robust and efficient flash memory solutions.
Package
Pinout
1. Data Pins (DQ0-DQ15): These 16 pins are used for data input and output.
2. Command/Address Pins (CMD, ADDR): Pins for command and address input.
3. Chip Enable (CE): Used to enable the chip.
4. Write Protect (WP): Provides write protection functionality.
5. Ready/Busy (R/B): Indicates when the device is ready for the next command.
6. Ground (GND): Provides the ground reference.
7. Power (VCC, VCCQ): Power supply pins for the device.
8. NAND Flash specific pins (RE, WE): Control read and write operations.
This device is commonly used in applications requiring storage solutions such as smartphones, tablets, and other embedded systems.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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