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MT29F256G08CECEBJ4-37ITR:E
IC FLASH 256GBIT PAR 132VBGA
- Fabricante
- Mfr. Parte #MT29F256G08CECEBJ4-37ITR:E
- Paquete
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Especificaciones
| Part Status | Obsolete |
| DigiKey Programmable | Not Verified |
| Memory Type | Non-Volatile |
| Memory Format | FLASH |
| Technology | FLASH - NAND (MLC) |
| Memory Size | 256Gbit |
| Memory Organization | 32G x 8 |
| Memory Interface | Parallel |
| Clock Frequency | 267 MHz |
| Voltage - Supply | 2.7V ~ 3.6V |
| Operating Temperature | -40°C ~ 85°C (TA) |
| Mounting Type | Surface Mount |
| Package / Case | 132-VBGA |
| Supplier Device Package | 132-VBGA (12x18) |
| Base Product Number | MT29F256G08 |
Descripción general
Description
Key features include:
- Form Factor: Typically available in a BGA (Ball Grid Array) package.
- Interface: Supports ONFI (Open NAND Flash Interface) for improved compatibility and performance.
- Endurance: Designed for high endurance with a significant number of program/erase cycles.
- Data Retention: Ensures reliable data retention for several years, typically ranging from 10 to 20 years under proper conditions.
This chip is ideal for applications requiring high-density storage solutions with a focus on speed and reliability.
Features
1. Interface: It uses a ONFI 1.0/2.0 interface for high-speed data transfer.
2. Density: Offers 256 Gigabits of storage capacity.
3. Organization: Typically organized as 2048 pages of 128 bytes each (or 64 pages of 2KB).
4. Read Speed: Supports fast read speeds, enhancing system performance.
5. Write/Erase Cycles: Designed for high endurance, supporting numerous write/erase cycles.
6. Data Retention: Offers reliable data retention, typically around 10 years at 25°C.
7. Power Management: Features low power consumption modes for energy efficiency.
8. Package Type: Available in a BGA (Ball Grid Array) package format for compact designs.
This device is suitable for various applications, including mobile devices, SSDs, and embedded systems, where high-density storage and performance are essential.
Package
Pinout
Key pin functions include:
- Data Pins (DQ0-DQ7): Bi-directional data lines for data input and output.
- Command Input (CLE): Command latch enable for command input.
- Address Input (ALE): Address latch enable for address input.
- Chip Enable (CE#): Activates the chip for read/write operations.
- Write Enable (WE#): Initiates a write operation.
- Read Enable (RE#): Initiates a read operation.
- Reset (RE#): Resets the device.
- Ready/Busy (R/B#): Indicates the status of the device (ready or busy).
- Vcc and Vss: Power supply and ground pins respectively.
This device is used in various applications requiring high-density storage solutions.
Manufacturer
Application
Equivalent
- Micron MT29F256G08CFAAWP: Same capacity but different packaging
- Samsung K9GAG08U0M: Similar capacity and technology
- Toshiba TH58TEG7D2FBA: Comparable NAND technology with 256Gb capacity
Always verify compatibility in terms of voltage, package type, and interface before substitution.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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