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MT29F1G08ABBEAH4-AITX:E
IC FLASH 1GBIT PARALLEL 63VFBGA
- Fabricante
- Mfr. Parte #MT29F1G08ABBEAH4-AITX:E
- Paquete VFBGA-63
- Hoja de datos
- En stock5377
100% original & Nuevo
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Garantía de 365 días
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Especificaciones
| Package | Tray |
| ProductStatus | Obsolete |
| MemoryType | Non-Volatile |
| MemoryFormat | FLASH |
| Technology | FLASH - NAND |
| MemorySize | 1Gb (128M x 8) |
| MemoryInterface | Parallel |
| Voltage-Supply | 1.7V ~ 1.95V |
| OperatingTemperature | -40°C ~ 85°C (TA) |
| MountingType | Surface Mount |
| Package/Case | 63-VFBGA |
Descripción general
Description
Key specifications include its organization, which typically includes pages of 2048 bytes, and a block size of 128 KB. The device supports multiple programming and erasing cycles, making it suitable for various applications, including smartphones, tablets, and embedded systems.
The suffix 'AITX:E' indicates specific features and compliance with environmental standards, such as RoHS. Overall, the MT29F1G08ABBEAH4-AITX:E is designed to offer high performance, low power consumption, and durability for demanding storage requirements in modern electronic devices.
Features
1. Interface: It supports a standard ONFI (Open NAND Flash Interface) interface for compatibility with various controllers.
2. NAND Type: This device is a multi-level cell (MLC) NAND, which offers a balance between performance and cost.
3. Density: 1 Gbit density, suitable for a variety of applications including mobile devices, consumer electronics, and embedded systems.
4. Operating Voltage: Typically operates at a voltage range of 2.7V to 3.6V, making it energy efficient.
5. Read/Program/Erase Performance: Offers fast read speeds and reasonable program/erase times, suitable for high-performance applications.
6. Temperature Range: Designed for standard industrial temperature ranges, ensuring reliable operation in diverse environments.
7. Endurance: Features a high number of program/erase cycles, enhancing longevity for applications requiring frequent writing.
This chip is ideal for applications needing reliable, high-density storage solutions.
Package
Pinout
1. Data I/O (DQ0-DQ7): 8 data input/output lines for bidirectional data transfer.
2. Command and Address Pins: Including CE# (Chip Enable), WE# (Write Enable), RE# (Read Enable), and A0-A10 for command and address signaling.
3. Control Signals: Such as R/B# (Ready/Busy), which indicates the status of the device.
4. Power and Ground: VCC for power supply and VSS for ground connections.
5. Additional signals: Including the WP# (Write Protect) pin for protection against accidental writes.
This device operates under specific voltage levels and timing constraints, suitable for various applications in embedded systems.
Manufacturer
Application
Equivalent
1. Samsung K9GAG08U0M
2. Hynix H27UCG8T2B
3. Micron MT29F1G08ABAEAWP
4. Toshiba TH58TEG7D2FBA
Ensure to check specifications like package type, voltage, and interface for compatibility.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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