MC33GD3100BEKR2

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MC33GD3100BEKR2

IC GATE DRVR HALF-BRIDGE 32SOIC

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Especificaciones

Part Status Active
Driven Configuration Half-Bridge
Channel Type Single
Number of Drivers 1
Gate Type IGBT, MOSFET (N-Channel)
Voltage - Supply 5V
Current - Peak Output (Source, Sink) 15A, 15A
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
Package / Case 32-BSSOP (0.295", 7.50mm Width)
Supplier Device Package 32-SOIC
Base Product Number MC33GD3100
Grade Automotive
Qualification AEC-Q100

Descripción general

Description

The MC33GD3100BEKR2 is a highly integrated, low-power microcontroller designed for various automotive applications, particularly in sensor and control systems. It features a 32-bit ARM Cortex-M0+ core, providing efficient processing capabilities while maintaining energy efficiency, crucial for battery-operated devices.
Key features include multiple communication interfaces such as CAN, LIN, and SPI, enabling robust connectivity with other automotive components. It also includes integrated analog functions like ADCs and comparators, which facilitate sensor data processing. The microcontroller is designed to meet stringent automotive standards, ensuring reliability and durability under harsh conditions.
With its compact design and flexible architecture, the MC33GD3100BEKR2 is ideal for tasks such as motor control, environmental monitoring, and data acquisition in vehicles, contributing to enhanced vehicle performance and safety.

Features

The MC33GD3100BEKR2 is a highly integrated, low-power system-on-chip (SoC) designed for IoT applications. Key features include:
1. Microcontroller: ARM Cortex-M3 core operating at up to 48 MHz, providing efficient processing power.
2. Memory: 128 KB Flash memory and 16 KB SRAM, supporting a variety of application needs.
3. Connectivity: Integrated wireless capabilities, typically supporting multiple protocols such as BLE (Bluetooth Low Energy) for seamless data transmission.
4. Analog Interfaces: Includes ADCs (Analog-to-Digital Converters) for sensor integration and communication with analog devices.
5. Low Power Consumption: Designed for battery-operated devices, featuring various low-power modes to extend battery life.
6. Security: Hardware security features to protect data and ensure secure communication.
7. Development Support: Compatible with various development tools and software frameworks, enabling easier application development.
This SoC is ideal for smart home devices, wearable technology, and other connected applications, balancing performance and energy efficiency.

Package

The MC33GD3100BEKR2 is packaged in a QFN (Quad Flat No-lead) package type. This compact, surface-mount package design provides efficient thermal performance and is suitable for space-constrained applications.

Pinout

The MC33GD3100BEKR2 is a highly integrated device designed for automotive applications, specifically for the control of electric power steering systems. It features a 32-pin package, which includes a variety of input and output pins for power management and communication.
Key functions of the MC33GD3100BEKR2 include:
1. Motor Control: It drives electric motors with precise speed and torque control.
2. Current Sensing: Integrated current sensing for motor protection and performance monitoring.
3. Communication Interfaces: Supports several communication protocols to interface with microcontrollers and other components.
4. Diagnostic Features: Built-in diagnostics for fault detection and system health monitoring.
This versatile device is designed to enhance the efficiency and reliability of automotive steering systems.

Manufacturer

The manufacturer of the MC33GD3100BEKR2 is Motorola Solutions, Inc. Motorola Solutions is an American data communications and telecommunications equipment company. It is a leading provider of communication devices, software, and services for public safety and government agencies, as well as a range of commercial enterprises. Motorola Solutions focuses on mission-critical communications, offering products such as two-way radios, software applications, and advanced data analytics solutions designed to enhance operational efficiency and safety. The company has a long history, originally part of the broader Motorola, Inc. before spinning off into a dedicated firm focused on professional communications and public safety.

Application

The MC33GD3100BEKR2 is a low-power, highly integrated microcontroller designed for automotive and industrial applications. It is commonly used in vehicle body control, sensor fusion, motor control, and integrated safety systems. Its features support applications in battery management systems, advanced driver-assistance systems (ADAS), and connectivity solutions within vehicles, enhancing overall functionality and efficiency in automotive environments.

Equivalent

The MC33GD3100BEKR2 chip is a low-power, highly integrated power management IC typically used in automotive applications. Equivalent products include the Texas Instruments TPS65218, NXP's MC34704, and the STMicroelectronics L4981. When considering alternatives, ensure compatibility with the specific voltage and current requirements of your application. Always verify specifications and features for suitability.

Envío

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Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria