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LFE3-70EA-8FN672C
IC FPGA 380 I/O 672FPBGA
- Fabricante
- Mfr. Parte #LFE3-70EA-8FN672C
- Paquete BBGA-672
- Hoja de datos LFE3-70EA-8FN672C DataSheet
- En stock6229
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
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Especificaciones
| Package | Tray |
| Series | ECP3 |
| ProductStatus | Active |
| NumberofLABs/CLBs | 8375 |
| NumberofLogicElements/Cells | 67000 |
| TotalRAMBits | 4526080 |
| NumberofI/O | 380 |
| Voltage-Supply | 1.14V ~ 1.26V |
| MountingType | Surface Mount |
| OperatingTemperature | 0°C ~ 85°C (TJ) |
| Package/Case | 672-BBGA |
Descripción general
Description
This FPGA operates at a voltage of 1.2V and offers a variety of I/O options, including LVDS, making it flexible for different interfacing needs. The chip comes in a 672-ball FBGAA package, allowing for a compact design in space-constrained applications.
Key features include advanced power management, a range of configured memory options, and integrated DSP blocks that enhance its performance for arithmetic computations. The LFE3-70EA-8FN672C is ideal for use in consumer electronics, automotive, and industrial applications, where efficiency and adaptability are crucial. With its programmable nature, developers can tailor the functionality to specific requirements, making it a versatile choice in modern electronic design.
Features
1. Logic Elements: It has 70K logic elements, allowing for complex design implementations.
2. I/O Pins: The device offers up to 72 user I/O pins with flexible I/O standards including LVTTL, LVCMOS, and HSTL.
3. Embedded Memory: It supports up to 4.5 Mbits of embedded memory, providing ample storage for data processing.
4. DSP Blocks: The FPGA includes DSP blocks for efficient digital signal processing.
5. Clock Management: Integrated clock management features help optimize performance and reduce power consumption.
6. Power Efficiency: Designed for low power operation, making it suitable for battery-operated devices.
7. Configuration: Supports various configuration options including JTAG and SPI.
8. Development Tools: Compatible with Lattice's Diamond design software for streamlined development.
This FPGA is ideal for applications in communications, automotive, consumer electronics, and industrial control systems.
Package
Pinout
This FPGA offers a variety of functions, including configurable logic blocks, digital signal processing capabilities, and memory support. It is designed for applications requiring high performance in a compact form factor, such as communications, automotive, industrial, and consumer electronics. It supports multiple I/O standards and has versatile power management features.
Manufacturer
Application
Equivalent
1. Xilinx Artix-7 (e.g., XC7A100T)
2. Intel Cyclone V (e.g., 5CEFA2F23C7N)
3. Microsemi SmartFusion2 (e.g., M2S010)
Always verify specific requirements and features, as performance and capabilities may differ.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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