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KLUDG4UHDC-B0E1
Oscillators RoHS
- Fabricante
- Mfr. Parte #KLUDG4UHDC-B0E1
- Paquete
- Hoja de datos
- En stock2833
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Especificaciones
Descripción general
Description
In a general context, introductions to such frameworks typically cover the purpose, core features, and potential applications. They may outline the system's architecture, functionality, and the problem it addresses. For instance, if KLUDG4UHDC-B0E1 is a software solution, the introduction would describe its key functionalities, user interface, and integration capabilities. If it is hardware, information on specifications, performance metrics, and use cases would be included.
For a comprehensive understanding, refer to official documentation or resources provided by the creator or organization associated with KLUDG4UHDC-B0E1, as these would offer accurate and detailed insights tailored specifically to the entity in question.
Features
1. Form Factor: It commonly comes in an M.2 form factor, which is compact and suitable for slim laptops and ultrabooks.
2. Interface: Utilizes the NVMe (Non-Volatile Memory Express) protocol over a PCIe (Peripheral Component Interconnect Express) interface, providing faster data transfer speeds compared to SATA-based SSDs.
3. Capacity: Often available in multiple storage capacities, catering to different storage needs.
4. Performance: Offers high read and write speeds, significantly enhancing boot times and application load times compared to traditional hard drives.
5. Reliability: Features flash memory technology with no moving parts, making it more resistant to physical shock and less prone to mechanical failure.
6. Energy Efficiency: Consumes less power than traditional HDDs, which can lead to longer battery life in portable devices.
7. Advanced Features: May include features like Samsung's Dynamic Thermal Guard, which protects the device from overheating by managing the temperature.
This SSD is popular for its balance of performance, reliability, and energy efficiency, making it a suitable choice for modern computing needs.
Package
Pinout
The pin count for eMMC chips like the KLUDG4UHDC-B0E1 usually aligns with the JEDEC standards, often featuring around 153 to 169 Ball Grid Array (BGA) pins, although the exact number can vary based on the specific version and design. These pins facilitate connectivity for power, ground, data transfer, and control signals.
In terms of function, this chip serves as non-volatile storage, meaning it retains data even when power is lost. It integrates NAND flash memory and a flash memory controller into one package, providing a compact and efficient storage solution. It supports various operations such as reading, writing, and erasing data.
For precise details on the pin count and functions, consulting the manufacturer's datasheet for this specific model is recommended.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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