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KLMAG1JETD-B041
16GB eMMC 5.1 FBGA-153 Memory (ICs) RoHS
- Fabricante
- Mfr. Parte #KLMAG1JETD-B041
- Paquete
- Hoja de datos KLMAG1JETD-B041 DataSheet
- En stock24354
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
RFQ y Obtenga más descuentos
Especificaciones
| Packaging | FBGA-153 |
| Controller Operating Voltage (VCCQ) | 1.7V~1.95V;2.7V~3.6V |
| Interface | eMMC 5.1 |
| Memory Size | 16GB |
| NAND Operating Voltage (VCCF) | 2.7V~3.6V |
| Operating temperature | -25℃~+85℃ |
| Reading Speed in Sequence | 330MB/S |
| Writing Speed in Sequence | 50MB/S |
Descripción general
Description
If it pertains to an aircraft part, it could involve a component used in the operation or maintenance of a jet. The code may signify its specifications, manufacturing details, or compatibility with certain aircraft models.
To understand its significance better, one would typically consult technical manuals, product databases, or the manufacturer's documentation. If more details regarding its application or context are provided, a more tailored response could be offered.
Features
1. Capacity: Typically available in various capacities, allowing for scalable memory options.
2. Speed: High data transfer rates, often around 3200 MHz or higher, ensuring fast performance.
3. Form Factor: DDR4 DIMM format, compatible with most modern motherboards.
4. Design: Sleek aesthetics, often featuring RGB lighting for customizable visual effects.
5. Heat Spreader: Equipped with an aluminum heat spreader for improved thermal management during heavy usage.
6. XMP Support: Intel Extreme Memory Profile (XMP) support for easy overclocking and optimized performance settings.
This module is ideal for gamers and content creators seeking reliability and speed in their systems.
Package
Pinout
Key functions include high-speed data access, support for various UFS protocols, and improved random read/write performance, making it suitable for smartphones, tablets, and other mobile devices. Its compact design and efficient power usage enhance overall device performance and user experience.
Manufacturer
Application
Equivalent
1. Samsung K4F1A1 series LPDDR4 chips
2. Micron MT53D series LPDDR4 chips
3. Hynix H9TP32A series LPDDR4 chips
Always verify compatibility with your specific application requirements.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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