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KLM8G1GEUF-B04P
8GB MLC eMMC 5.1 FBGA-153(11.5x13) Memory (ICs) RoHS
- Fabricante
- Mfr. Parte #KLM8G1GEUF-B04P
- Paquete
- Hoja de datos KLM8G1GEUF-B04P DataSheet
- En stock9595
100% original & Nuevo
24 horas listos para el envío
Garantía de 365 días
RFQ y Obtenga más descuentos
Especificaciones
| Packaging | FBGA-153(11.5x13) |
| Controller Operating Voltage (VCCQ) | 1.7V~1.95V;2.7V~3.6V |
| Interface | eMMC 5.1 |
| Memory Size | 8GB |
| NAND Operating Voltage (VCCF) | 1.8V;3.3V |
| Operating temperature | -40℃~+95℃ |
| Reading Speed in Sequence | 330MB/S |
| Writing Speed in Sequence | 40MB/S |
| configuration | MLC |
Descripción general
Description
Key specifications often include a data transfer rate of up to 3200 MT/s, a capacity of 8GB, and a form factor that fits standard motherboard slots. These memory modules are built to enhance multitasking capabilities and support advanced applications, ensuring smooth operation in demanding environments. Overall, KLM8G1GEUF-B04P is recognized for its reliability and compatibility across a range of devices, making it a popular choice for both manufacturers and consumers seeking dependable memory solutions.
Features
- Capacity: 1GB, suitable for basic computing tasks.
- Type: DDR3 SDRAM, ensuring compatibility with devices designed for DDR3.
- Form Factor: SO-DIMM, ideal for laptops and small form-factor PCs.
- Speed: Typically operates at 1333 MHz or 1600 MHz, providing decent performance for everyday applications.
- Voltage: Operates at 1.5V, which is standard for DDR3 memory, contributing to energy efficiency.
- Error Correction: Non-ECC, making it suitable for consumer-grade applications where advanced error correction is not required.
- Dimensions: Compact physical size, optimized for space-constrained environments.
This module is ideal for upgrading memory in older laptops or for use in basic computing tasks like web browsing, document editing, and light multitasking.
Package
Pinout
The primary function of this memory chip is to serve as a volatile memory storage solution in various electronic devices, including computers, mobile devices, and tablets. It is designed to provide fast data access and efficient performance for applications requiring temporary data storage while the device is powered on. DDR3 technology allows for higher bandwidth and improved energy efficiency compared to its predecessor, DDR2. The KLM8G1GEUF-B04P specifically supports data rates up to 1600 MT/s and operates at a voltage of 1.5V, which contributes to its effectiveness in high-performance scenarios.
Manufacturer
Application
Equivalent
1. Hynix HY5PS1G831C
2. Micron MT8HTF12864HY-667
3. Samsung K4T1G164QF-HC3
Always verify compatibility with your specific application before substituting components.
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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