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K9F1G08U0D-SCB0
- Fabricante
- Mfr. Parte #K9F1G08U0D-SCB0
- Paquete
- Hoja de datos
- En stock5035
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Especificaciones
| Manufacturer | Samsung Electro-Mechanics |
| Package | TSOPI-48 |
Descripción general
Description
Key specifications include a standard NAND interface, with support for various programming and erasing cycles. It operates with a supply voltage typically around 2.7V to 3.6V, and it is optimized for high-speed data transfer and reliability. The chip incorporates error correction capabilities to ensure data integrity.
The K9F1G08U0D-SCB0 is suitable for applications requiring efficient storage solutions, making it a popular choice in the competitive landscape of flash memory technology. Its compact form factor and robust performance characteristics enable it to meet the demands of modern electronic devices.
Features
1. Capacity: 1 Gb (Gigabit) of storage, suitable for various embedded systems.
2. Interface: It utilizes the NAND flash interface for efficient data transfer.
3. Architecture: Built on a multi-level cell (MLC) architecture, allowing for higher data storage density.
4. Data Transfer Rate: Offers fast read and write speeds, essential for performance-sensitive applications.
5. Endurance: Designed for a high number of program/erase cycles, enhancing longevity in applications.
6. Low Power Consumption: Optimized for low power usage, making it suitable for battery-operated devices.
7. Temperature Range: Operates within a wide temperature range, ensuring reliability in various environmental conditions.
8. Applications: Commonly used in consumer electronics, mobile devices, and other embedded applications.
Overall, the K9F1G08U0D-SCB0 is a reliable and efficient choice for modern storage needs.
Package
Pinout
The main functions of these pins include:
1. Data Pins (DQ0-DQ7): 8 data input/output pins for data transfer.
2. Command Pins (CLE, ALE): Command and address latch enable pins used to input commands and addresses.
3. Chip Enable (CE): Chip select pin to activate the memory chip.
4. Write Enable (WE): Used to initiate write operations.
5. Read Enable (RE): Used to initiate read operations.
6. Ready/Busy (R/B): Indicates the status of the chip (ready or busy).
7. Ground (VSS): Common ground connection.
8. Power Supply (VCC): Power supply pin.
9. Block Protection (BP0, BP1): Used for block protection features.
This chip is designed for high-density storage applications in consumer electronics and embedded systems.
Manufacturer
Application
Equivalent
Envío
Métodos de envíoNosotros
ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.
Referencia de tarifas de envío (DHL/FedEx):
DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.
FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.
EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.
Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.
Pagos
Payment Methods
El plazo de pago es 100% prepagado.
Actualmente, solo aceptamos los siguientes métodos de pago:
1. de PayPal
2. Tarjeta de crédito/débito
3. Transferencia bancaria
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