K4F8E3S4HD-MGCL

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K4F8E3S4HD-MGCL

8Gbit x32 LPDDR4 FBGA-200 Memory (ICs) RoHS

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  • Mfr. Parte #K4F8E3S4HD-MGCL
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  • En stock3561

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Especificaciones

Packaging FBGA-200
Interface LPDDR4
Memory Format x32
Memory Size 8Gbit
Operating temperature -25℃~+85℃
Voltage - Supply 1.8V;1.1V

Descripción general

Description

K4F8E3S4HD-MGCL is not a widely recognized or standard term in scientific literature, technology, or common knowledge as of my last update in October 2023. It may refer to a specific chemical compound, product code, or research designation within a specialized field.
To provide an accurate introduction, please clarify the context in which you encountered this term—such as chemistry, materials science, or a particular industry. If it relates to a specific process, material, or technology, further details would help in delivering a more precise explanation.

Features

The K4F8E3S4HD-MGCL is a type of DRAM (Dynamic Random Access Memory) chip produced by Samsung. It is part of the LPDDR4X memory family, which is designed for mobile devices and applications requiring lower power consumption while maintaining high performance.
Key features include:
1. Capacity: Typically, this chip has a density of 8 Gb (gigabits), or 1 GB (gigabyte), suitable for modern smartphones and tablets.

2. Data Rate: Supports a data rate of up to 4266 MT/s (megatransfers per second), enabling fast data access and transfer speeds.
3. Voltage: Operates at a low voltage of 0.6V, contributing to energy efficiency and extending battery life in portable devices.
4. Package Type: Available in a small form factor package, allowing for space-saving in device design.
5. Application: Primarily used in high-performance mobile applications, including smartphones, tablets, and other mobile computing devices.
These features make the K4F8E3S4HD-MGCL an excellent choice for manufacturers looking to enhance device performance while optimizing power consumption.

Package

The K4F8E3S4HD-MGCL is typically packaged in a TSOP (Thin Small Outline Package) format, designed for memory chips. This package type is characterized by its flat, rectangular shape and low profile, making it suitable for high-density applications.

Pinout

The K4F8E3S4HD-MGCL is a DRAM memory chip produced by Samsung, specifically a 1 Gb (Gigabit) DDR3 SDRAM. It features a package with a pin count of 78 pins, typically in a BGA (Ball Grid Array) format.
The primary functions of the K4F8E3S4HD-MGCL include:
1. Data Storage: It serves as volatile memory, providing temporary storage for data in computing systems.
2. Data Transfer: Supports high-speed data transfer rates, crucial for applications requiring fast read/write operations.
3. Compatibility: Designed for use in various electronic devices, including laptops, desktops, and other consumer electronics.
4. Power Management: Operates at low voltage levels to improve energy efficiency in electronic devices.
This chip is commonly used in computing and consumer electronics due to its performance characteristics and reliability.

Manufacturer

The K4F8E3S4HD-MGCL is manufactured by Samsung Electronics, a South Korean multinational company. Samsung is primarily known for its consumer electronics, including smartphones, televisions, and home appliances, but it is also a major player in the semiconductor industry. The company produces a wide range of memory products, such as DRAM and NAND flash memory, which are essential components in various electronic devices. Samsung Electronics is part of the larger Samsung Group, one of the largest conglomerates in South Korea, with diversified interests in areas like technology, construction, and finance. As a leader in innovation and technology, Samsung continues to invest heavily in research and development, maintaining its position as a pivotal player in both the consumer electronics and semiconductor markets.

Application

K4F8E3S4HD-MGCL is a type of NAND flash memory primarily used in consumer electronics, such as smartphones, tablets, and laptops. Its applications include data storage for operating systems, applications, and user data, enabling fast read/write speeds and improved performance. Additionally, it can be utilized in embedded systems, automotive applications, and IoT devices for efficient data handling and storage solutions.

Equivalent

The K4F8E3S4HD-MGCL is a NAND flash memory chip. Equivalent products may include the Samsung K9GAG08U0M, Micron MT29F8G08ABAEAWP, and Hynix H26M31003G5M. Always verify specifications and compatibility for your specific application.

Envío

Métodos de envíoNosotros

ofrecer servicios de envío globales a través de DHL, FedEx, TNT, UPS, o cualquier otro expediente de su elección.


Referencia de tarifas de envío (DHL/FedEx):

DHL: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 2-5 días hábiles.

FedEx: El costo de envío oscila entre $25-$40 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

UPS: El costo de envío oscila entre $25-$45 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

TNT: El costo de envío oscila entre $25-$65 (0.5kg), con un tiempo de entrega estimado de 3-7 días hábiles.

EMS: El costo de envío oscila entre $30-$50 (0.5kg), con un plazo de entrega estimado de 7-15 días hábiles.

Correo aéreo registrado: El costo de envío es de $2-$4 (0.1kg), con un tiempo de entrega estimado de 5-20 días hábiles.

Pagos

Payment Methods

El plazo de pago es 100% prepagado.

Actualmente, solo aceptamos los siguientes métodos de pago:

1. de PayPal

2. Tarjeta de crédito/débito

3. Transferencia bancaria